Inventor · disambiguated record
Renuka S. Divakaruni
Also filed as: DIVAKARUNI RENUKA S · DIVAKARUNI RENUKA SHASTRI
12 granted patents·303 citations·filing 1986–1999
93Inventor score
Files withIBM12
Top patents by PatentIndex Score
12 records- 0185US4885038AMethod of making multilayered ceramic structures having an internal distribution of copper-based conductorsIBM·Filed 1986·Granted Dec 5, 1989·72 cites·10 claims
- 0281US4772346AMethod of bonding inorganic particulate materialIBM·Filed 1987·Granted Sep 20, 1988·65 cites·18 claims
- 0374US6124041ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1999·Granted Sep 26, 2000·35 cites·10 claims
- 0458US5135595AProcess for fabricating a low dielectric composite substrateIBM·Filed 1990·Granted Aug 4, 1992·24 cites·9 claims
- 0555US5468445ACeramic via composition, multilayer ceramic circuit containing same, and process for using sameIBM·Filed 1994·Granted Nov 21, 1995·20 cites·6 claims
- 0654US5147741APhenyl-endcapped depolymerizable polymerIBM·Filed 1990·Granted Sep 15, 1992·12 cites·10 claims
- 0753US5139851ALow dielectric composite substrateIBM·Filed 1990·Granted Aug 18, 1992·22 cites·19 claims
- 0851US5277725AProcess for fabricating a low dielectric composite substrateIBM·Filed 1992·Granted Jan 11, 1994·17 cites·15 claims
- 0950US5925443ACopper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1991·Granted Jul 20, 1999·14 cites·5 claims
- 1048US5336444ACeramic via composition, multilayer ceramic circuit containing same, and process for using sameIBM·Filed 1992·Granted Aug 9, 1994·14 cites·5 claims
- 1141US4987211APhenyl-endcapped depolymerizable polymerIBM·Filed 1989·Granted Jan 22, 1991·7 cites·4 claims
- 1230US6358439B1Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled viasIBM·Filed 1995·Granted Mar 19, 2002·1 cites·5 claims
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