Inventor · disambiguated record
Bo-Jiun Yang
Also filed as: YANG BO-JIUN
5 granted patents·9 pending applications·3 citations·filing 2020–2025
66Inventor score
Files withMEDIATEK INC14
Top patents by PatentIndex Score
14 records- 0190US12087664B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2023·Granted Sep 10, 2024·1 cites·7 claims
- 0288US11640930B2Semiconductor package having liquid-cooling lidMEDIATEK INC·Filed 2020·Granted May 2, 2023·2 cites·14 claims
- 0377US2025377649A1Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control methodMEDIATEK INC·Filed 2025·Application pending·0 cites
- 0469US12411474B2Integrated circuit configurable to perform adaptive thermal ceiling control in per-functional-block manner, associated main circuit, associated electronic device and associated thermal control methodMEDIATEK INC·Filed 2022·Granted Sep 9, 2025·0 cites·26 claims
- 0560US12300573B2Semiconductor device and manufacturing method thereofMEDIATEK INC·Filed 2022·Granted May 13, 2025·0 cites·22 claims
- 0660US2025233040A1Semiconductor package structureMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0756US2024274517A1Semiconductor package structure, method of forming the same and semiconductor package assembly having the sameMEDIATEK INC·Filed 2024·Application pending·0 cites
- 0854US12021068B2Semiconductor device with dummy thermal features on interposerMEDIATEK INC·Filed 2021·Granted Jun 25, 2024·0 cites·13 claims
- 0954US2023282625A1Semiconductor package having a thick logic dieMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1053US2023260866A1Semiconductor package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1152US2023197667A1Semiconductor device and manufacturing method thereofMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1252US2023282626A1High-bandwidth package-on-package structureMEDIATEK INC·Filed 2023·Application pending·0 cites
- 1351US2023046413A1Semiconductor package assemblyMEDIATEK INC·Filed 2022·Application pending·0 cites
- 1449US2024196537A1Semiconductor package assemblyMEDIATEK INC·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →