Inventor · disambiguated record
Michiel Van Soestbergen
Also filed as: VAN SOESTBERGEN MICHIEL
3 granted patents·1 pending application·2 citations·filing 2019–2023
50Inventor score
Files withNXP BV4
Top patents by PatentIndex Score
4 records- 0170US10825789B1Underbump metallization dimension variation with improved reliabilityNXP BV·Filed 2019·Granted Nov 3, 2020·2 cites·21 claims
- 0255US12061228B2Degradation monitor for bond wire to bond pad interfacesNXP BV·Filed 2022·Granted Aug 13, 2024·0 cites·26 claims
- 0350US2024413192A1Isolation structureNXP BV·Filed 2023·Application pending·0 cites
- 0443US11508669B2Method and apparatus for improved circuit structure thermal reliability on printed circuit board materialsNXP BV·Filed 2019·Granted Nov 22, 2022·0 cites·17 claims
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