Inventor · disambiguated record
Kiyoshi Nishioka
Also filed as: NISHIOKA KIYOSHI
23 granted patents·7 pending applications·41 citations·filing 1992–2020
91Inventor score
Files withJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH9SUMITOMO SEIKA CHEMICALS8NATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY5LINTEC CORP2NIPPON STEEL CORP2
Top patents by PatentIndex Score
30 records- 0181US10113061B2Polyester resin composition and moldingSUMITOMO SEIKA CHEMICALS·Filed 2015·Granted Oct 30, 2018·2 cites·3 claims
- 0276US10784120B2Laminate, etching mask, method of producing laminate, method of producing etching mask, and method of producing thin film transistorJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2016·Granted Sep 22, 2020·2 cites·13 claims
- 0374US10756383B2All solid state secondary-battery additive, all-solid-state secondary battery, and method for producing sameOSAKA RES INST IND SCIENCE & TECH·Filed 2016·Granted Aug 25, 2020·2 cites·14 claims
- 0474US9552985B2Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic deviceJAPAN ADVANCED INST OF SCIENCE AND TECH·Filed 2014·Granted Jan 24, 2017·3 cites·16 claims
- 0564US5357443AMethod of estimating properties of steel productNIPPON STEEL CORP·Filed 1992·Granted Oct 18, 1994·32 cites·11 claims
- 0664US2020095410A1Polyolefin resin composition, molding, and polyolefin resin filmUNIV NAT CORP KANAZAWA·Filed 2019·Application pending·0 cites
- 0762US11133191B2Method of producing etching mask, etching mask precursor, and oxide layer, and method of manufacturing thin film transistorJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2019·Granted Sep 28, 2021·0 cites·5 claims
- 0860US11084915B2Composition for resin surface rougheningSUMITOMO SEIKA CHEMICALS·Filed 2016·Granted Aug 10, 2021·0 cites·7 claims
- 0960US10787540B2Aliphatic polycarbonate and binder resin composition containing said polycarbonateNATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY·Filed 2017·Granted Sep 29, 2020·0 cites·8 claims
- 1060US10340388B2Intermediate semiconductor device having an aliphatic polycarbonate layerJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2018·Granted Jul 2, 2019·0 cites·9 claims
- 1159US10749034B2Semiconductor device, method for producing same and aliphatic polycarbonateJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2018·Granted Aug 18, 2020·0 cites·17 claims
- 1259US9985137B2Semiconductor device having a decomposed aliphatic polycarbonate layerJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2014·Granted May 29, 2018·0 cites·7 claims
- 1356US10450485B2Pressure sensitive adhesive sheetLINTEC CORP·Filed 2016·Granted Oct 22, 2019·0 cites·19 claims
- 1455US10640643B2Pyrolytic binderNATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY·Filed 2017·Granted May 5, 2020·0 cites·7 claims
- 1554US9783665B2Polyolefin-based resin compositionSUMITOMO SEIKA CHEMICALS·Filed 2014·Granted Oct 10, 2017·0 cites·11 claims
- 1653US9842916B2Oxide semiconductor layer and production method therefor, oxide semiconductor precursor, oxide semiconductor layer, semiconductor element, and electronic deviceJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2016·Granted Dec 12, 2017·0 cites·16 claims
- 1751US11084902B2Aliphatic polycarbonate resin, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming methodSUMITOMO SEIKA CHEMICALS·Filed 2017·Granted Aug 10, 2021·0 cites·10 claims
- 1850US11142611B2Aliphatic polycarbonate resin for forming partition, partition material, substrate and production method therefor, production method for wiring substrate, and wiring forming methodSUMITOMO SEIKA CHEMICALS·Filed 2017·Granted Oct 12, 2021·0 cites·8 claims
- 1949US10759901B2Thermally decomposable binderNATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY·Filed 2015·Granted Sep 1, 2020·0 cites·11 claims
- 2049US10634996B2Composite member and method of manufacturing the same, and aliphatic polycarbonate-containing layerJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2016·Granted Apr 28, 2020·0 cites·21 claims
- 2149US2020407497A1Novel macroinitiator, production method thereof and method for producing block copolymerNATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY·Filed 2018·Application pending·0 cites
- 2249US2020239630A1Novel aliphatic polycarbonateNATIONAL UNIV CORPORATION TOKYO UNIV OF AGRICULTURE AND TECHNOLOGY·Filed 2018·Application pending·0 cites
- 2348US10457607B2Binder resin compositionSUMITOMO SEIKA CHEMICALS·Filed 2016·Granted Oct 29, 2019·0 cites·4 claims
- 2448US2017253733A1Polyolefin resin composition, molding, and polyolefin resin filmNAT UNIV CORP KANAZA UNIV·Filed 2015·Application pending·0 cites
- 2546US12030987B2Aliphatic polycarbonateSUMITOMO SEIKA CHEMICALS·Filed 2020·Granted Jul 9, 2024·0 cites·16 claims
- 2646US10400336B2Oxide precursor, oxide layer, semiconductor element, and electronic device, and method of producing oxide layer and method of producing semiconductor elementJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2015·Granted Sep 3, 2019·0 cites·20 claims
- 2746US2018096853A1Method of producing etching mask, etching mask precursor, and oxide layer, and method of manufacturing thin film transistorJAPAN ADVANCED INSTITUTE OF SCIENCE AND TECH·Filed 2016·Application pending·0 cites
- 2842US6638473B2Cooling device for blast furnace bottom wall bricksNIPPON STEEL CORP·Filed 2001·Granted Oct 28, 2003·0 cites·3 claims
- 2938US2020263007A1Polyolefin-based resin composition and polyolefin-based resin filmSUMITOMO SEIKA CHEMICALS·Filed 2017·Application pending·0 cites
- 3035US2018298251A1Pressure-sensitive adhesive and pressure-sensitive adhesive sheetLINTEC CORP·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →