Inventor · disambiguated record
Hiroyasu Matsugai
Also filed as: MATSUGAI HIROYASU
26 granted patents·9 pending applications·54 citations·filing 2003–2023
94Inventor score
Files withSONY SEMICONDUCTOR SOLUTIONS CORP19SONY CORP11MATSUGAI HIROYASU2FUJITSU LTD1MAEDA KENSAKU1
Top patents by PatentIndex Score
35 records- 0194US10854667B2Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatusSONY CORP·Filed 2019·Granted Dec 1, 2020·4 cites·20 claims
- 0292US11574949B2Camera package, manufacturing method of camera package, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Feb 7, 2023·4 cites·12 claims
- 0392US9842879B2Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatusSONY CORP·Filed 2015·Granted Dec 12, 2017·7 cites·14 claims
- 0488US10355042B2Solid-state imaging device, manufacturing method of solid-state imaging element, and imaging apparatusSONY CORP·Filed 2017·Granted Jul 16, 2019·4 cites·34 claims
- 0588US8710608B2Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatusMAEDA KENSAKU·Filed 2011·Granted Apr 29, 2014·5 cites·7 claims
- 0685US11194135B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 7, 2021·2 cites·8 claims
- 0783US11130299B2Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Sep 28, 2021·2 cites·8 claims
- 0883US9472472B2Semiconductor device and method of manufacturing semiconductor deviceMATSUGAI HIROYASU·Filed 2012·Granted Oct 18, 2016·6 cites·14 claims
- 0983US8859391B2Semiconductor device, method for manufacturing semiconductor device, method for laminating semiconductor wafers, and electronic deviceMATSUGAI HIROYASU·Filed 2012·Granted Oct 14, 2014·7 cites·18 claims
- 1082US8384173B2Solid-state imaging device and method for making the same, and imaging apparatusSONY CORP·Filed 2010·Granted Feb 26, 2013·3 cites·8 claims
- 1181US10379323B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 13, 2019·1 cites·21 claims
- 1280US10431618B2Stacked lens structure method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2016·Granted Oct 1, 2019·1 cites·38 claims
- 1380US8410569B2Solid-state imaging device and method for producing the sameYOSHIHARA IKUO·Filed 2010·Granted Apr 2, 2013·3 cites·5 claims
- 1479US11543621B2AF module, camera module, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jan 3, 2023·2 cites·10 claims
- 1579US9941321B2Semiconductor device and method of manufacturing semiconductor deviceSONY CORP·Filed 2016·Granted Apr 10, 2018·2 cites·20 claims
- 1678US11525984B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·14 claims
- 1774US10818717B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 1872US9111828B2Solid-state imaging device, method for manufacturing solid-state imaging device, and electronic apparatusSONY CORP·Filed 2014·Granted Aug 18, 2015·0 cites·18 claims
- 1970US11342371B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2020·Granted May 24, 2022·0 cites·17 claims
- 2066US10627549B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Apr 21, 2020·1 cites·20 claims
- 2159US2014077324A1Solid-state image pickup device, method of manufacturing solid-state image pickup device, and electronic apparatusSONY CORP·Filed 2013·Application pending·0 cites
- 2258US12132064B2Camera package, method for manufacturing camera package, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2020·Granted Oct 29, 2024·0 cites·20 claims
- 2356US10866345B2Laminated lens structure, camera module, and method for manufacturing laminated lens structureSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2017·Granted Dec 15, 2020·0 cites·20 claims
- 2455US2024407184A1Light detection device, method of manufacturing the same, electronic equipment, and mobile bodySONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2555US2025364513A1Package, semiconductor device, and method for manufacturing packageSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 2654US2025219037A1Package and method for manufacturing packageSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2023·Application pending·0 cites
- 2752US2024038802A1Imaging apparatus and manufacturing method for imaging apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 2851US2025120205A1Optical detecting device, manufacturing method therefor, and electronic equipmentSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 2951US2024055456A1Solid-state imaging deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Application pending·0 cites
- 3050US10534162B2Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jan 14, 2020·0 cites·18 claims
- 3150US2024396294A1Light emitting device, method for manufacturing light emitting device, and distance measuring deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2022·Application pending·0 cites
- 3249US10690814B2Lens substrate, semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jun 23, 2020·0 cites·20 claims
- 3343US10712543B2Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrateSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jul 14, 2020·0 cites·12 claims
- 3443US8867581B2Semiconductor laser and method of manufacturing the sameSONY CORP·Filed 2013·Granted Oct 21, 2014·0 cites·13 claims
- 3538US2004029401A1Organic insulating film forming method, semiconductor device manufacture method, and TFT substrate manufacture methodFUJITSU LTD·Filed 2003·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →