Inventor · disambiguated record
Bok-Sik Myung
Also filed as: MYUNG BOK SIK
4 granted patents·2 pending applications·56 citations·filing 2012–2023
70Inventor score
Top patents by PatentIndex Score
6 records- 0193US10431536B2Interposer substrate and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Oct 1, 2019·53 cites·20 claims
- 0266US9627126B2Printed circuit board including inductorSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 18, 2017·2 cites·19 claims
- 0360US8970042B2Circuit board, comprising a core insulation filmSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Mar 3, 2015·1 cites·18 claims
- 0456US2024274556A1Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0549US11289430B2Semiconductor package and a method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 29, 2022·0 cites·19 claims
- 0639US2015022985A1Device-embedded package substrate and semiconductor package including the sameNA KYUNG-TAE·Filed 2014·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →