Inventor · disambiguated record
Ya-Hsin Deng
Also filed as: DENG YA-HSIN
1 granted patent·3 pending applications·0 citations·filing 2017–2019
7Inventor score
Files withLUXNET CORP4
Top patents by PatentIndex Score
4 records- 0146US10656355B2Heat dissipation structure of horizontal optical-communication sub-assemblyLUXNET CORP·Filed 2019·Granted May 19, 2020·0 cites·20 claims
- 0231US2018190520A1Composite heat-dissipating substrateLUXNET CORP·Filed 2017·Application pending·0 cites
- 0331US2018248336A1Assembly of semiconductor and highly thermally conductive heat-dissipating substratesLUXNET CORP·Filed 2018·Application pending·0 cites
- 0430US2018191131A1Heat-dissipating semiconductor assemblyLUXNET CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →