Inventor · disambiguated record
Geon-Woo Park
Also filed as: PARK GEON · PARK GEON WOO
7 granted patents·6 pending applications·69 citations·filing 2006–2025
82Inventor score
Files withSAMSUNG ELECTRONICS CO LTD3LEE SE-YOUNG2TAEGU TEC LTD2UNIV DONG A RES FOUND FOR IND ACAD COOP2ELEVENLITER INC1
Top patents by PatentIndex Score
13 records- 0183USD855197SRechargeable dual massage apparatusHOMELEC KOREA CO LTD·Filed 2018·Granted Jul 30, 2019·26 cites·1 claims
- 0277USD718357SCutting insertTAEGU TEC LTD·Filed 2014·Granted Nov 25, 2014·24 cites·1 claims
- 0376US9217419B2System and method for controlling voltage at point of common coupling of wind farmNAT UNIV CHONBUK IND COOP FOUND·Filed 2015·Granted Dec 22, 2015·3 cites·6 claims
- 0466USD715840SCutting insertTAEGU TEC LTD·Filed 2014·Granted Oct 21, 2014·15 cites·1 claims
- 0566US2025369120A1Substrate processing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0660US2024123827A1Apparatus for controlling a vehicle, system having the same and method for monitoring thereofHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 0758US2025256329A1Nickel-based superalloy mixed powder having zirconia for directed energy deposition, nickel-based superalloy directed energy deposition structure and method of manufacturing the sameUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2025·Application pending·0 cites
- 0858US2025000442A1Method and apparatus for determining patellar dislocationELEVENLITER INC·Filed 2023·Application pending·0 cites
- 0954US2025360564A1Method of controlling microstructure of nickel-based superalloy directed energy deposition structureUNIV DONG A RES FOUND FOR IND ACAD COOP·Filed 2025·Application pending·0 cites
- 1048US8252630B2Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip packageLEE SE-YOUNG·Filed 2008·Granted Aug 28, 2012·0 cites·16 claims
- 1146US8530275B2Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip packageLEE SE-YOUNG·Filed 2012·Granted Sep 10, 2013·0 cites·3 claims
- 1246US7345925B2Soft erasing methods for nonvolatile memory cellsSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Mar 18, 2008·1 cites·19 claims
- 1340US2007177427A1Nonvolatile memory device and method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2007·Application pending·0 cites
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