Inventor · disambiguated record
Jon Bradley Lasiter
Also filed as: LASITER JON · LASITER JON B · LASITER JON BRADLEY
31 granted patents·11 pending applications·198 citations·filing 2006–2021
95Inventor score
Files withQUALCOMM INC30QUALCOMM MEMS TECHNOLOGIES INC5LASITER JON BRADLEY3BLACK JUSTIN PHELPS1LASITER JON B1
Top patents by PatentIndex Score
42 records- 0197US10478858B2Piezoelectric ultrasonic transducer and processQUALCOMM INC·Filed 2014·Granted Nov 19, 2019·56 cites·22 claims
- 0297US9263370B2Semiconductor device with via barQUALCOMM INC·Filed 2013·Granted Feb 16, 2016·58 cites·26 claims
- 0396US10685924B2Antenna-on-package arrangementsQUALCOMM INC·Filed 2017·Granted Jun 16, 2020·16 cites·12 claims
- 0494US10001552B2Three-port piezoelectric ultrasonic transducerQUALCOMM INC·Filed 2015·Granted Jun 19, 2018·7 cites·40 claims
- 0593US10734332B2High aspect ratio interconnects in air gap of antenna packageQUALCOMM INC·Filed 2017·Granted Aug 4, 2020·9 cites·31 claims
- 0691US10490880B2Glass-based antenna array packageQUALCOMM INC·Filed 2017·Granted Nov 26, 2019·6 cites·30 claims
- 0790US11223116B2Glass ceramic antenna packageQUALCOMM INC·Filed 2018·Granted Jan 11, 2022·6 cites·20 claims
- 0890US10497748B2Integrated piezoelectric micromechanical ultrasonic transducer pixel and arrayQUALCOMM INC·Filed 2016·Granted Dec 3, 2019·9 cites·30 claims
- 0988US11450964B2Antenna assembly with a conductive cageQUALCOMM INC·Filed 2020·Granted Sep 20, 2022·2 cites·30 claims
- 1086US7916980B2Interconnect structure for MEMS deviceQUALCOMM MEMS TECHNOLOGIES INC·Filed 2006·Granted Mar 29, 2011·14 cites·21 claims
- 1182US9325420B2Electro-optical transceiver device to enable chip-to-chip interconnectionQUALCOMM INC·Filed 2014·Granted Apr 26, 2016·5 cites·30 claims
- 1276US10618079B2Piezoelectric micromechanical ultrasonic transducers and transducer arraysQUALCOMM INC·Filed 2017·Granted Apr 14, 2020·1 cites·25 claims
- 1375US11115576B2Sensor module with a collar configured to be attached to a camera module for a user deviceQUALCOMM INC·Filed 2019·Granted Sep 7, 2021·1 cites·31 claims
- 1472US8971675B2Interconnect structure for MEMS deviceLASITER JON BRADLEY·Filed 2011·Granted Mar 3, 2015·3 cites·14 claims
- 1571US9190208B2Metal-insulator-metal capacitors on glass substratesQUALCOMM MEMS TECHNOLOGIES INC·Filed 2014·Granted Nov 17, 2015·2 cites·28 claims
- 1667US10109784B2Sensor deviceQUALCOMM INC·Filed 2016·Granted Oct 23, 2018·1 cites·30 claims
- 1764US10770646B2Manufacturing method for flexible PMUT arrayQUALCOMM INC·Filed 2017·Granted Sep 8, 2020·1 cites·12 claims
- 1863US11678043B2Sensor module with a collarQUALCOMM INC·Filed 2021·Granted Jun 13, 2023·0 cites·20 claims
- 1960US8896521B2Metal-insulator-metal capacitors on glass substratesLASITER JON BRADLEY·Filed 2012·Granted Nov 25, 2014·1 cites·31 claims
- 2055US11877041B2Sensor with multiple focal zonesQUALCOMM INC·Filed 2020·Granted Jan 16, 2024·0 cites·29 claims
- 2155US11711594B2Dual image sensor packageQUALCOMM INC·Filed 2021·Granted Jul 25, 2023·0 cites·30 claims
- 2255US9548350B2High quality factor capacitors and methods for fabricating high quality factor capacitorsQUALCOMM INC·Filed 2014·Granted Jan 17, 2017·0 cites·9 claims
- 2355US2014104288A1Through substrate via inductorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2453US9773862B2High quality factor capacitors and methods for fabricating high quality factor capacitorsQUALCOMM INC·Filed 2016·Granted Sep 26, 2017·0 cites·14 claims
- 2552US10394004B2Systems and devices having single-sided wafer-level opticsQUALCOMM INC·Filed 2016·Granted Aug 27, 2019·0 cites·28 claims
- 2652US9105602B2Embedded three-dimensional capacitorQUALCOMM INC·Filed 2014·Granted Aug 11, 2015·0 cites·20 claims
- 2751US2014144681A1Adhesive metal nitride on glass and related methodsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2850US2014104284A1Through substrate via inductorsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2949US11411321B2Broadband antenna systemQUALCOMM INC·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 3049US10722918B2Release hole plus contact via for fine pitch ultrasound transducer integrationQUALCOMM INC·Filed 2016·Granted Jul 28, 2020·0 cites·14 claims
- 3148US11228086B2Antenna package and configuration for millimeter waveQUALCOMM INC·Filed 2018·Granted Jan 18, 2022·0 cites·18 claims
- 3245US9510454B2Integrated interposer with embedded active devicesQUALCOMM INC·Filed 2014·Granted Nov 29, 2016·0 cites·16 claims
- 3345US2015311271A1Landside embedded inductor for fanout packagingQUALCOMM INC·Filed 2014·Application pending·0 cites
- 3443US11277559B2Image sensor systemQUALCOMM INC·Filed 2020·Granted Mar 15, 2022·0 cites·13 claims
- 3542US10199152B2Embedded thin film magnetic carrier for integrated voltage regulatorQUALCOMM INC·Filed 2015·Granted Feb 5, 2019·0 cites·12 claims
- 3641US2019259677A1Device comprising integration of die to die with polymer planarization layerQUALCOMM INC·Filed 2018·Application pending·0 cites
- 3738US2014035935A1Passives via barSHENOY RAVINDRA V·Filed 2012·Application pending·0 cites
- 3838US2017271919A1Wireless implant powering via subcutaneous power relayQUALCOMM INC·Filed 2016·Application pending·0 cites
- 3938US2013049143A1Release activated thin film getterLASITER JON B·Filed 2011·Application pending·0 cites
- 4038US2013181893A1Electrostatically transduced sensors composed of photochemically etched glassBLACK JUSTIN PHELPS·Filed 2012·Application pending·0 cites
- 4138US2013241939A1High capacitance density metal-insulator-metal capacitorsLASITER JON BRADLEY·Filed 2012·Application pending·0 cites
- 4235US2013135184A1Encapsulated arrays of electromechanical systems devicesTUNG MING-HAU·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →