Inventor · disambiguated record
Fumio Miyagawa
Also filed as: MIYAGAWA FUMIO
4 granted patents·2 pending applications·122 citations·filing 1988–2003
79Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0169US4980754APackage for superconducting devicesKOTANI SEIGO·Filed 1989·Granted Dec 25, 1990·37 cites·9 claims
- 0269US4890155APackage for mounting a semiconductor chip of ultra-high frequencySHINKO ELECTRIC IND CO·Filed 1988·Granted Dec 26, 1989·37 cites·11 claims
- 0368US5557074ACoaxial line assembly of a package for a high frequency elementFUJITSU LTD·Filed 1994·Granted Sep 17, 1996·41 cites·4 claims
- 0432US5277357AProcess for making a metal wall of a package used for accommodating electronic elementsSHINKO ELECTRIC IND CO·Filed 1992·Granted Jan 11, 1994·7 cites·9 claims
- 0532US2004140549A1Wiring structure and its manufacturing methodFiled 2003·Application pending·0 cites
- 0630US2004084759A1Housing preform and electronic apparatus using the sameSHINKO ELECTRONIC IND CO LTD·Filed 2003·Application pending·0 cites
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