Inventor · disambiguated record
Brian Bliven
Also filed as: BLIVEN BRIAN · BLIVEN BRIAN M
22 granted patents·3 pending applications·233 citations·filing 1999–2025
95Inventor score
Top patents by PatentIndex Score
25 records- 0194US9554807B2Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgeryMCGINLEY ENG SOLUTIONS LLC·Filed 2015·Granted Jan 31, 2017·26 cites·31 claims
- 0294US9468445B2Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgeryMCGINLEY ENG SOLUTIONS LLC·Filed 2015·Granted Oct 18, 2016·21 cites·21 claims
- 0388US6731382B2Self-calibrating 3D machine measuring system useful in motor vehicle wheel alignmentSNAP ON TECH INC·Filed 2001·Granted May 4, 2004·51 cites·22 claims
- 0487US11284906B2Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgeryMCGINLEY ENG SOLUTIONS LLC·Filed 2019·Granted Mar 29, 2022·4 cites·3 claims
- 0587USD908301SWaste receptacle with lidCEPHEID·Filed 2018·Granted Jan 19, 2021·1 cites·1 claims
- 0686US9833244B2Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgeryMCGINLEY ENG SOLUTIONS LLC·Filed 2014·Granted Dec 5, 2017·15 cites·26 claims
- 0786US6839972B2Self-calibrating position determination systemSNAP ON TOOLS CORP·Filed 2002·Granted Jan 11, 2005·33 cites·33 claims
- 0883US10349952B2Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgeryMCGINLEY ENG SOLUTIONS LLC·Filed 2016·Granted Jul 16, 2019·3 cites·7 claims
- 0980US2025251417A1Sample Processing Module Array Handling System and MethodsCEPHEID·Filed 2025·Application pending·0 cites
- 1079US12232745B2Surgical saw with sensing technology for determining cut through of bone and depth of the saw blade during surgeryMCGINLEY ENG SOLUTIONS LLC·Filed 2022·Granted Feb 25, 2025·0 cites·23 claims
- 1178USD1040463SWaste receptacleCEPHEID·Filed 2020·Granted Aug 27, 2024·0 cites·1 claims
- 1277US12235279B2Sample processing module array handling system and methodsCEPHEID·Filed 2020·Granted Feb 25, 2025·0 cites·30 claims
- 1371US10871498B2Sample processing module array handling system and methodsCEPHEID·Filed 2017·Granted Dec 22, 2020·0 cites·40 claims
- 1468US6439245B1Method for transferring wafers from a conveyor system to a wafer processing stationLAM RES CORP·Filed 2000·Granted Aug 27, 2002·9 cites·8 claims
- 1565US6612315B2Bowl, spin, rinse, and dry module, and method for loading a semiconductor wafer into a spin, rinse, and dry moduleLAM RES CORP·Filed 2001·Granted Sep 2, 2003·9 cites·13 claims
- 1661US6415804B1Bowl for processing semiconductor wafersLAM RES CORP·Filed 1999·Granted Jul 9, 2002·23 cites·12 claims
- 1760US6607072B2Wheel and conveyor system for transporting semiconductor wafersLAM RES CORP·Filed 2002·Granted Aug 19, 2003·5 cites·11 claims
- 1860US2022134338A1Diagnostic assay system with replaceable processing modules and remote monitoringCEPHEID·Filed 2021·Application pending·0 cites
- 1958US6752162B1Edge roller assembly, method for contacting an edge of a substrate, and transport system for transporting semiconductor wafers to a wafer processing stationLAM RES CORP·Filed 2000·Granted Jun 22, 2004·5 cites·14 claims
- 2053US6973112B2Passive gas flow management and filtration device for use in an excimer or transverse discharge laserVISX INC·Filed 2003·Granted Dec 6, 2005·5 cites·32 claims
- 2152US7355695B2Wavefront calibration analyzer and methodsAMO MFG USA LLC·Filed 2004·Granted Apr 8, 2008·4 cites·44 claims
- 2250US6557202B1Wafer scrubbing brush core having an internal motor and method of making the sameLAM RES CORP·Filed 1999·Granted May 6, 2003·17 cites·16 claims
- 2343US2008094574A1Sterile Hand Held Refractive Surgery Slit Lamp Illumination SystemVISX INC·Filed 2007·Application pending·0 cites
- 2435US7331672B2Sterile hand held refractive surgery slit lamp illumination systemVISX INC·Filed 2004·Granted Feb 19, 2008·0 cites·27 claims
- 2531US6505417B2Method for controlling airflow on a backside of a semiconductor wafer during spin processingLAM RES CORP·Filed 1999·Granted Jan 14, 2003·2 cites·17 claims
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