Inventor
CHO HANS S
KR48 patents
⚠️ This page may combine multiple inventors who share the name “CHO HANS S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
22 patentsUS7575962B2Aug 18, 2009
Fin structure and method of manufacturing fin transistor adopting the fin structure
SAMSUNG ELECTRONICS CO LTD47 citations93
US7566364B2Jul 28, 2009
Method of fabricating orientation-controlled single-crystalline wire and method of fabricating transistor having the same
SAMSUNG ELECTRONICS CO LTD28 citations93
US7297615B2Nov 20, 2007
Si nanowire substrate, method of manufacturing the same, and method of manufacturing thin film transistor using the same
SAMSUNG ELECTRONICS CO LTD32 citations93
US7859054B2Dec 28, 2010
Poly-Si thin film transistor and organic light-emitting display having the same
SAMSUNG ELECTRONICS CO LTD9 citations84
US7611932B2Nov 3, 2009
Method of manufacturing a thin film transistor
SAMSUNG ELECTRONICS CO LTD13 citations84
US7557411B2Jul 7, 2009
Semi-conductor-on-insulator structure, semiconductor devices using the same and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7999322B2Aug 16, 2011
Poly-Si thin film transistor and organic light-emitting display having the same
SAMSUNG ELECTRONICS CO LTD6 citations74
US7642177B2Jan 5, 2010
Method of manufacturing nanowire
SAMSUNG ELECTRONICS CO LTD7 citations74
US7511381B2Mar 31, 2009
Thin film transistor and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD5 citations74
US7772711B2Aug 10, 2010
Semiconductor device including single crystal silicon layer
SAMSUNG ELECTRONICS CO LTD6 citations72
US8021936B2Sep 20, 2011
Method of manufacturing thin film transistor
SAMSUNG ELECTRONICS CO LTD3 citations63
US8022408B2Sep 20, 2011
Crystalline nanowire substrate, method of manufacturing the same, and method of manufacturing thin film transistor using the same
SAMSUNG ELECTRONICS CO LTD2 citations63
US7714330B2May 11, 2010
Si nanowire substrate
SAMSUNG ELECTRONICS CO LTD2 citations63
US7662678B2Feb 16, 2010
Method of forming a more highly-oriented silicon layer and substrate having the same
SAMSUNG ELECTRONICS CO LTD5 citations63
US7531240B2May 12, 2009
Substrate with locally integrated single crystalline silicon layer and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD3 citations63
US7750424B2Jul 6, 2010
Microlens and an image sensor including a microlens
SAMSUNG ELECTRONICS CO LTD4 citations62
US8012819B2Sep 6, 2011
Semiconductor device including gate stack formed on inclined surface and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7667300B2Feb 23, 2010
Semiconductor device including gate stack formed on inclined surface and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7629205B2Dec 8, 2009
Thin film transistor having double-layered gate electrode and method of manufacturing the thin film transistor
SAMSUNG ELECTRONICS CO LTD0 citations52
US7560317B2Jul 14, 2009
Method of forming single crystalline silicon layer, structure including the same, and method of fabricating thin film transistor using the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7439197B2Oct 21, 2008
Method of fabricating a capacitor
SAMSUNG ELECTRONICS CO LTD1 citations52
US7390706B2Jun 24, 2008
Method of forming channel region of TFT composed of single crystal Si
SAMSUNG ELECTRONICS CO LTD0 citations52
CHO HANS S
7 patentsUS8258050B2Sep 4, 2012
Method of making light trapping crystalline structures
CHO HANS S37 citations92
US8203137B2Jun 19, 2012
Photonic structure
CHO HANS S17 citations84
US8803212B2Aug 12, 2014
Three-dimensional crossbar array
CHO HANS S4 citations73
US8389388B2Mar 5, 2013
Photonic device and method of making the same
CHO HANS S6 citations72
US10008666B2Jun 26, 2018
Non-volatile resistive memory cells
CHO HANS S2 citations64
US9466793B2Oct 11, 2016
Memristors having at least one junction
CHO HANS S2 citations62
US8258049B2Sep 4, 2012
Method of manufacturing nanowire
CHO HANS S0 citations52
HEWLETT PACKARD ENTPR DEV LP
7 patentsUS10109346B2Oct 23, 2018
Apparatus having a memory cell and a shunt device
HEWLETT PACKARD ENTPR DEV LP3 citations73
US9847482B2Dec 19, 2017
Resistive memory devices with an oxygen-supplying layer
HEWLETT PACKARD ENTPR DEV LP5 citations73
US9847378B2Dec 19, 2017
Resistive memory devices with a multi-component electrode
HEWLETT PACKARD ENTPR DEV LP6 citations73
US9715926B2Jul 25, 2017
Memristive device switching by alternating polarity pulses
HEWLETT PACKARD ENTPR DEV LP2 citations73
US10062842B2Aug 28, 2018
Composite selector electrodes
HEWLETT PACKARD ENTPR DEV LP1 citations52
US9954165B2Apr 24, 2018
Sidewall spacers
HEWLETT PACKARD ENTPR DEV LP0 citations52
US9911915B2Mar 6, 2018
Multiphase selectors
HEWLETT PACKARD ENTPR DEV LP1 citations52
YIN HUAXIANG
4 patentsUS8405062B2Mar 26, 2013
Method of forming poly-si pattern, diode having poly-si pattern, multi-layer cross point resistive memory device having poly-si pattern, and method of manufacturing the diode and the memory device
YIN HUAXIANG9 citations84
US8309404B2Nov 13, 2012
Poly-Si thin film transistor and organic light-emitting display having the same
YIN HUAXIANG8 citations84
US8187905B2May 29, 2012
Method of forming a microlens and a method for manufacturing an image sensor
YIN HUAXIANG9 citations84
US8508009B2Aug 13, 2013
Microlens and an image sensor including a microlens
YIN HUAXIANG0 citations52