Inventor · disambiguated record
Hok Man Wan
Also filed as: WAN HOK MAN
1 granted patent·2 pending applications·5 citations·filing 2010–2023
26Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0170US7977231B1Die bonder incorporating dual-head dispenserASM ASSEMBLY AUTOMATION LTD·Filed 2010·Granted Jul 12, 2011·5 cites·20 claims
- 0251US2025071962A1Bond head having individually-displaceable bond armsASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
- 0350US2025031357A1Bonding tool incorporating decoupled motion axesASMPT SINGAPORE PTE LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →