Inventor · disambiguated record
Masashi Yamaura
Also filed as: YAMAURA MASASHI
10 granted patents·13 pending applications·36 citations·filing 2001–2024
84Inventor score
Top patents by PatentIndex Score
23 records- 0181US7995984B2Semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2008·Granted Aug 9, 2011·12 cites·24 claims
- 0278US9334573B2Layered silicate silver surface treatment agent, sulfidation prevention film and light-emitting device with treated silver layerHITACHI CHEMICAL CO LTD·Filed 2013·Granted May 10, 2016·5 cites·5 claims
- 0376US9525114B2Optical semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Dec 20, 2016·4 cites·6 claims
- 0474US2025382453A1Resin composition and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 0567US6831360B2Semiconductor device having an elastic resin with a low modulus of elasticityRENESAS TECH CORP·Filed 2001·Granted Dec 14, 2004·13 cites·16 claims
- 0661US2024026118A1Molding resin composition and electronic component deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 0761US2023092703A1Resin composition for molding and electronic component apparatusSHOWA DENKO MATERIALS CO LTD·Filed 2021·Application pending·0 cites
- 0859US2025276246A1Information processing system, non-transitory computer-readable storage medium having information processing program stored therein, information processing method, and information processing apparatusNINTENDO CO LTD·Filed 2024·Application pending·0 cites
- 0957US11049835B2Semiconductor moduleMURATA MANUFACTURING CO·Filed 2019·Granted Jun 29, 2021·0 cites·3 claims
- 1054US2025236744A1Resin composition for molding and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 1153US9524946B2Electronic deviceMURATA MANUFACTURING CO·Filed 2014·Granted Dec 20, 2016·0 cites·17 claims
- 1251US10403593B2Semiconductor moduleMURATA MANUFACTURING CO·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 1346US7468294B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2004·Granted Dec 23, 2008·2 cites·15 claims
- 1445US9634210B2Optical semiconductor device production method and optical semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 25, 2017·0 cites·6 claims
- 1544US2011141428A1Process for producing spacer for liquid crystal display apparatus, ink for spacer formation, liquid crystal display appartus and process for manufacturing the sameMARUYAMA NAOKI·Filed 2007·Application pending·0 cites
- 1642US10555418B2Component moduleMURATA MANUFACTURING CO·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
- 1742US2024034833A1Resin composition for molding and electronic component deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 1842US2025289951A1Resin composition for molding and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 1942US2025340732A1Molding resin composition and electronic component deviceRESONAC CORP·Filed 2023·Application pending·0 cites
- 2040US2015175811A1Silver-sulfidation-preventing material and method for forming silver-sulfidation-preventing film, and method for producing light-emitting device and light-emitting deviceHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2137US2005029666A1Semiconductor device structural body and electronic deviceFiled 2002·Application pending·0 cites
- 2234US2020102454A1Resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2017·Application pending·0 cites
- 2330US2021061986A1Epoxy resin composition and electronic component deviceHITACHI CHEMICAL CO LTD·Filed 2019·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →