Inventor · disambiguated record
Shigeharu Tsunoda
Also filed as: TSUNODA SHIGEHARU
32 granted patents·3 pending applications·585 citations·filing 1988–2018
97Inventor score
Files withHITACHI LTD16HITACHI AUTOMOTIVE SYSTEMS LTD7RENESAS TECH CORP6ARAI SATOSHI2ELPIDA MEMORY INC1
Top patents by PatentIndex Score
35 records- 0188US9778086B2Flow sensor with a housing that accommodates an auxiliary channel having an opening into which a fluid to be measured is takenARAI SATOSHI·Filed 2012·Granted Oct 3, 2017·7 cites·15 claims
- 0286US6770547B1Method for producing a semiconductor deviceRENESAS TECH CORP·Filed 2000·Granted Aug 3, 2004·40 cites·28 claims
- 0386US6624504B1Semiconductor device and method for manufacturing the sameHITACHI LTD·Filed 2000·Granted Sep 23, 2003·43 cites·24 claims
- 0485US5914531ASemiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1997·Granted Jun 22, 1999·68 cites·21 claims
- 0585US5811877ASemiconductor device structureHITACHI LTD·Filed 1997·Granted Sep 22, 1998·84 cites·26 claims
- 0683US6930388B2Semiconductor device and method for manufacturing the same and semiconductor device-mounted structureRENESAS TECH CORP·Filed 2001·Granted Aug 16, 2005·37 cites·24 claims
- 0783US6822317B1Semiconductor apparatus including insulating layer having a protrusive portionRENESAS TECH CORP·Filed 2000·Granted Nov 23, 2004·37 cites·16 claims
- 0881US7057283B2Semiconductor device and method for producing the sameHITACHI LTD·Filed 2004·Granted Jun 6, 2006·26 cites·30 claims
- 0978US10751937B2Layer laminating molded object, powder layer laminating molding method, and ridge filterHITACHI LTD·Filed 2018·Granted Aug 25, 2020·1 cites·6 claims
- 1078US5371044AMethod of uniformly encapsulating a semiconductor device in resinHITACHI LTD·Filed 1992·Granted Dec 6, 1994·60 cites·20 claims
- 1175US6114192AMethod of manufacturing a semiconductor device having a ball grid array package structure using a supporting frameHITACHI LTD·Filed 1998·Granted Sep 5, 2000·39 cites·38 claims
- 1274US7141451B2Wireless communication medium and method of manufacturing the sameHITACHI LTD·Filed 2004·Granted Nov 28, 2006·20 cites·10 claims
- 1371US7172130B2Electronic device, rubber product, and methods for manufacturing the sameHITACHI LTD·Filed 2004·Granted Feb 6, 2007·15 cites·24 claims
- 1469US9778085B2Flow sensor with a protruding portion for height control and a cover for suppressing sinking of the cover during weldingHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Oct 3, 2017·2 cites·20 claims
- 1567US10568226B2Electronic control device and method for manufacturing electronic control deviceHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2016·Granted Feb 18, 2020·1 cites·8 claims
- 1667US4946633AMethod of producing semiconductor devicesHITACHI LTD·Filed 1988·Granted Aug 7, 1990·32 cites·25 claims
- 1762US6686226B1Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frameRENESAS TECH CORP·Filed 2000·Granted Feb 3, 2004·9 cites·22 claims
- 1861US9880040B2Flow sensorHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Jan 30, 2018·0 cites·18 claims
- 1959US9314942B2Ingot cutting apparatus and ingot cutting methodNISHINO HIDEHIKO·Filed 2009·Granted Apr 19, 2016·2 cites·12 claims
- 2059US7122087B2Method of manufacturing RFIDHITACHI LTD·Filed 2004·Granted Oct 17, 2006·6 cites·19 claims
- 2159US7084498B2Semiconductor device having projected electrodes and structure for mounting the sameRENESAS TECH CORP·Filed 2002·Granted Aug 1, 2006·9 cites·36 claims
- 2259US4983110AResin encapsulating apparatus for semiconductor devicesHITACHI LTD·Filed 1989·Granted Jan 8, 1991·23 cites·7 claims
- 2356US9880034B2Flow sensorHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Jan 30, 2018·0 cites·15 claims
- 2454US8110907B2Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrateYAMAGUCHI MASAHIRO·Filed 2009·Granted Feb 7, 2012·1 cites·19 claims
- 2554US5110515AMethod of encapsulating semiconductor chipsHITACHI LTD·Filed 1989·Granted May 5, 1992·19 cites·6 claims
- 2653US10507617B2Laser welded structure, electronic controller and manufacture method for laser welded structureHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2015·Granted Dec 17, 2019·0 cites·13 claims
- 2753US9964424B2Flow sensor and manufacturing method thereofHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted May 8, 2018·0 cites·12 claims
- 2853US6861294B2Semiconductor devices and methods of making the devicesRENESAS TECH CORP·Filed 2003·Granted Mar 1, 2005·4 cites·9 claims
- 2952US11279083B2Powder layered modeling apparatusHITACHI LTD·Filed 2018·Granted Mar 22, 2022·0 cites·10 claims
- 3052US9945707B2Flow sensor and method for producing resin structureHITACHI AUTOMOTIVE SYSTEMS LTD·Filed 2014·Granted Apr 17, 2018·0 cites·15 claims
- 3145US2019111617A1Resin powder, resin molded article, and laser powder molding deviceHITACHI LTD·Filed 2016·Application pending·0 cites
- 3245US2008185729A1Semiconductor element unit and complex thereof, semiconductor device and module thereof, assembled structure thereof and film substrate connection structureELPIDA MEMORY INC·Filed 2008·Application pending·0 cites
- 3344US11634577B2Resin powder material, laser powder molding method and deviceHITACHI LTD·Filed 2015·Granted Apr 25, 2023·0 cites·8 claims
- 3438US2012037303A1Method for attaching a temporary material to a piping module and method for conveying a piping moduleARAI SATOSHI·Filed 2011·Application pending·0 cites
- 3533US8524345B2Pipe moduleOOZEKI YOSHIO·Filed 2011·Granted Sep 3, 2013·0 cites·6 claims
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