Inventor · disambiguated record
Kosuke Yamashita
Also filed as: YAMASHITA KOSUKE
10 granted patents·8 pending applications·33 citations·filing 1975–2024
83Inventor score
Top patents by PatentIndex Score
18 records- 0188US7497987B2Refining method and refining apparatus for chromium-contained molten steelNIPPON STEEL CORP·Filed 2007·Granted Mar 3, 2009·6 cites·12 claims
- 0271US9899306B2Anisotropic conductive member and multilayer wiring substrateFUJIFILM CORP·Filed 2017·Granted Feb 20, 2018·2 cites·14 claims
- 0368US4035193AMethod and apparatus for calcining powdered material for cementMITSUBISHI HEAVY IND LTD·Filed 1975·Granted Jul 12, 1977·14 cites·4 claims
- 0466US11697754B2Thermal conductive layer, photosensitive layer, photosensitive composition, manufacturing method for thermal conductive layer, and laminate and semiconductor deviceFUJIFILM CORP·Filed 2020·Granted Jul 11, 2023·0 cites·19 claims
- 0562US2024339368A1Manufacturing method for bonded body, bonded body, manufacturing method for laminate, laminate, manufacturing method for device, and device, and composition for forming polyimide-containing precursor portionFUJIFILM CORP·Filed 2024·Application pending·0 cites
- 0660US6923573B2Apparatus and method for measuring temperature of molten metalNITTETSU PLANT DESIGNING CORP·Filed 2002·Granted Aug 2, 2005·11 cites·10 claims
- 0758US11848249B2Manufacturing method for thermal conductive layer, manufacturing method for laminate, and manufacturing method for semiconductor deviceFUJIFILM CORP·Filed 2022·Granted Dec 19, 2023·0 cites·15 claims
- 0849US10559548B2Anisotropic conductive bonding member, semiconductor device, semiconductor package and semiconductor device production methodFUJIFILM CORP·Filed 2018·Granted Feb 11, 2020·0 cites·17 claims
- 0948US11355439B2Structure, method for manufacturing structure, laminate, and semiconductor packageFUJIFILM CORP·Filed 2020·Granted Jun 7, 2022·0 cites·10 claims
- 1047US2012073973A1Anisotropically conductive memberYAMASHITA KOSUKE·Filed 2011·Application pending·0 cites
- 1143US9799594B2Microstructure, multilayer wiring board, semiconductor package and microstructure manufacturing methodFUJIFILM CORP·Filed 2016·Granted Oct 24, 2017·0 cites·7 claims
- 1242US10155998B2Method for recycling-processing of dust generated in converter furnace, and method for manufacturing steelASTEC IRIE CO LTD·Filed 2016·Granted Dec 18, 2018·0 cites·23 claims
- 1341US2004245682A1Method for refining molten iron containing chromiumFiled 2002·Application pending·0 cites
- 1440US2014085829A1Multi-layered board and semiconductor packageFUJIFILM CORP·Filed 2013·Application pending·0 cites
- 1536US2017046177A1Screen generating apparatusAZBIL CORP·Filed 2016·Application pending·0 cites
- 1636US2011311800A1Microstructure and microstructure production methodYAMASHITA KOSUKE·Filed 2011·Application pending·0 cites
- 1734US2016186278A1Method for Recycling-Processing of Dust Generated in Converter FurnaceASTEC IRIE CO LTD·Filed 2014·Application pending·0 cites
- 1832US2016153104A1Method for manufacturing metal-filled microstructureFUJIFILM CORP·Filed 2016·Application pending·0 cites
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