Inventor · disambiguated record
Martin W. Bayes
Also filed as: BAYES MARTIN · BAYES MARTIN W · BAYES MARTIN WILLIAM
22 granted patents·12 pending applications·214 citations·filing 1985–2025
94Inventor score
Files withSHIPLEY CO LLC14ROHM & HAAS ELECT MAT5TE CONNECTIVITY SOLUTIONS GMBH5TE Connectivity Services Gmbh4BRESE NATHANIEL E1
Top patents by PatentIndex Score
34 records- 0185US6531046B2Seed layer repair methodSHIPLEY CO LLC·Filed 2000·Granted Mar 11, 2003·44 cites·20 claims
- 0282US9102901B2Methods and compositions for removal of metal hardmasksROHM & HAAS ELECT MAT·Filed 2013·Granted Aug 11, 2015·5 cites·11 claims
- 0381US6054061AComposition for circuit board manufactureSHIPLEY CO LLC·Filed 1997·Granted Apr 25, 2000·54 cites·30 claims
- 0478US11843153B2Use of enhanced performance ultraconductive copper materials in cylindrical configurations and methods of forming ultraconductive copper materialsTE Connectivity Services Gmbh·Filed 2020·Granted Dec 12, 2023·1 cites·7 claims
- 0577US9228092B2Electrochemically deposited indium compositesROHM AND HAAS ELECTRONICS MATERIALS LLC·Filed 2013·Granted Jan 5, 2016·4 cites·8 claims
- 0675US11859093B2Printable non-curable thixotropic hot melt compositionTE CONNECTIVITY SOLUTIONS GMBH·Filed 2022·Granted Jan 2, 2024·0 cites·13 claims
- 0774US9863044B2Method for electroless metallizationROHM & HAAS ELECT MAT·Filed 2013·Granted Jan 9, 2018·1 cites·2 claims
- 0873US6261466B1Composition for circuit board manufactureSHIPLEY CO LLC·Filed 1998·Granted Jul 17, 2001·35 cites·20 claims
- 0972US9783890B2Process for electroless plating and a solution used for the sameROHM & HAAS ELECT MAT·Filed 2012·Granted Oct 10, 2017·1 cites·4 claims
- 1072US9499910B2Process for electroless plating and a solution used for the sameROHM & HAAS ELECT MAT·Filed 2015·Granted Nov 22, 2016·1 cites·4 claims
- 1172US2025290217A1Layered Plating Stack for Improved Contact Resistance in Corrosive EnvironmentsTE CONNECTIVITY SOLUTIONS GMBH·Filed 2025·Application pending·0 cites
- 1271US6660153B2Seed layer repair bathSHIPLEY CO LLC·Filed 2001·Granted Dec 9, 2003·15 cites·15 claims
- 1370US11859092B2Printable non-curable thixotropic hot melt compositionTE CONNECTIVITY SOLUTIONS GMBH·Filed 2021·Granted Jan 2, 2024·0 cites·13 claims
- 1468US2024110035A1Electrical stress grading compositions and devices including the sameTE CONNECTIVITY SOLUTIONS GMBH·Filed 2022·Application pending·0 cites
- 1565US12351936B2Layered plating stack for improved contact resistance in corrosive environmentsTE CONNECTIVITY SOLUTIONS GMBH·Filed 2023·Granted Jul 8, 2025·0 cites·12 claims
- 1665US8585885B2Electrochemically deposited indium compositesBRESE NATHANIEL E·Filed 2008·Granted Nov 19, 2013·4 cites·9 claims
- 1763US6660154B2Seed layerSHIPLEY CO LLC·Filed 2001·Granted Dec 9, 2003·9 cites·18 claims
- 1863US4717439AProcess for the treatment of copper oxide in the preparation of printed circuit boardsENTHONE·Filed 1985·Granted Jan 5, 1988·23 cites·10 claims
- 1959US11355872B2Mezzanine power pin for an electrical connector systemTE Connectivity Services Gmbh·Filed 2020·Granted Jun 7, 2022·0 cites·20 claims
- 2053US6372055B1Method for replenishing bathsSHIPLEY CO LLC·Filed 2000·Granted Apr 16, 2002·7 cites·14 claims
- 2152US12027281B2Metallic structure with desired combinations of mechanical and electrical characteristicsTE Connectivity Services Gmbh·Filed 2020·Granted Jul 2, 2024·0 cites·11 claims
- 2248US2018311736A1System and Method for Forming Nano-Particles in Additively-Manufactured Metal AlloysTE CONNECTIVITY CORP·Filed 2018·Application pending·0 cites
- 2346US2020294684A1Enhanced performance ultraconductive copper and process of makingTE Connectivity Services Gmbh·Filed 2020·Application pending·0 cites
- 2446US2005261152A1Cleaning compositionSHIPLEY CO LLC·Filed 2005·Application pending·0 cites
- 2542US2004258847A1Method of measuring component lossSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2640US2004084399A1Process of producing printed circuit boards and the circuit boards formed therebySHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2740US2018097325A1Corrosion Protection System and Method for Use with Electrical ContactsTYCO ELECTRONICS CORP·Filed 2016·Application pending·0 cites
- 2839US2004112869A1Cleaning compositionSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 2937US2004101624A1Treating metal surfaces with a modified oxide replacement compositionSHIPLEY CO LLC·Filed 2003·Application pending·0 cites
- 3035US5108786AMethod of making printed circuit boardsENTHONE OMI INC·Filed 1990·Granted Apr 28, 1992·5 cites·10 claims
- 3135US2002090484A1Plating bathSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 3234US2002127847A1Electrochemical co-deposition of metals for electronic device manufactureSHIPLEY CO LLC·Filed 2001·Application pending·0 cites
- 3333US8961678B2Organic solderability preservative and methodROHM & HAAS ELECT MAT·Filed 2012·Granted Feb 24, 2015·0 cites·5 claims
- 3432US6139762AMethods for manufacture of electronic devicesSHIPLEY CO LLC·Filed 1998·Granted Oct 31, 2000·5 cites·18 claims
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