Inventor · disambiguated record
Kuo K. Wang
Also filed as: WANG KUO K
6 granted patents·411 citations·filing 1988–1998
88Inventor score
Files withCORNELL RES FOUNDATION INC6
Top patents by PatentIndex Score
6 records- 0189US5817545APressurized underfill encapsulation of integrated circuitsCORNELL RES FOUNDATION INC·Filed 1996·Granted Oct 6, 1998·123 cites·6 claims
- 0287US5501266AMethod and apparatus for injection molding of semi-solid metalsCORNELL RES FOUNDATION INC·Filed 1994·Granted Mar 26, 1996·104 cites·19 claims
- 0385US6000924APressurized underfill encapsulation of integrated circuitsCORNELL RES FOUNDATION INC·Filed 1998·Granted Dec 14, 1999·89 cites·38 claims
- 0467US6023962AReservoir-slit rheometer for the viscosity measurement of fast-reacting polymersCORNELL RES FOUNDATION INC·Filed 1998·Granted Feb 15, 2000·35 cites·25 claims
- 0567US4861167ALine-heat-source thermal conductivity measuring systemCORNELL RES FOUNDATION INC·Filed 1988·Granted Aug 29, 1989·29 cites·22 claims
- 0653US5572434AMethod for simulating mold filling of semi-solid materialCORNELL RES FOUNDATION INC·Filed 1994·Granted Nov 5, 1996·31 cites·19 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →