Inventor · disambiguated record
Chen-Kuang Lien
Also filed as: LIEN CHEN-KUANG
6 granted patents·27 citations·filing 2011–2016
79Inventor score
Top patents by PatentIndex Score
6 records- 0191US8722531B1Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 13, 2014·13 cites·21 claims
- 0281US8673765B2Method and apparatus for back end of line semiconductor device processingWANG HUNG-CHIH·Filed 2012·Granted Mar 18, 2014·9 cites·20 claims
- 0380US8872342B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Oct 28, 2014·4 cites·22 claims
- 0468US10704158B2Electrochemical platingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 7, 2020·1 cites·20 claims
- 0555US9064934B2Barrier layer for copper interconnectTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 23, 2015·0 cites·20 claims
- 0640US9518332B2Electrochemical platingLIEN CHEN-KUANG·Filed 2011·Granted Dec 13, 2016·0 cites·20 claims
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