Inventor · disambiguated record
Dong-Bin Kim
Also filed as: KIM DONG-BIN
2 granted patents·2 pending applications·18 citations·filing 2001–2005
55Inventor score
Top patents by PatentIndex Score
4 records- 0169US6578567B2Wafer sawing apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Jun 17, 2003·17 cites·12 claims
- 0241US7481351B2Wire bonding apparatus and method for clamping a wireSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jan 27, 2009·1 cites·23 claims
- 0337US2005280503A1Semiconductor wafer having identification unit and method of identifying the semiconductor wafer using the identification unitLEE SANG-WOO·Filed 2005·Application pending·0 cites
- 0433US2005269713A1Apparatus and method for wire bonding and die attachingOH KOOK-JIN·Filed 2005·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →