Inventor · disambiguated record
Yong Ha Woo
Also filed as: HA WOO YONG
3 granted patents·1 pending application·0 citations·filing 2013–2015
40Inventor score
Technology areasH10W
Files withZHEN DING TECHNOLOGY CO LTD4
Top patents by PatentIndex Score
4 records- 0142US9173298B2Packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 27, 2015·0 cites·5 claims
- 0236US2015380391A1Packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 0335US9362248B2Coreless package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Granted Jun 7, 2016·0 cites·16 claims
- 0435US9165790B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 20, 2015·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →