Inventor · disambiguated record
Christophe Prior
Also filed as: PRIOR CHRISTOPHE
8 granted patents·1 pending application·114 citations·filing 2001–2003
85Inventor score
Files withST MICROELECTRONICS SA9
Top patents by PatentIndex Score
9 records- 0190US7095123B2Sensor semiconductor package, provided with an insert, and method for making sameST MICROELECTRONICS SA·Filed 2002·Granted Aug 22, 2006·78 cites·18 claims
- 0263US6972497B2Optical semiconductor device and method of manufactureST MICROELECTRONICS SA·Filed 2003·Granted Dec 6, 2005·13 cites·5 claims
- 0353US6858933B2Injection mold for an optical semiconductor package and corresponding optical semiconductor packageST MICROELECTRONICS SA·Filed 2001·Granted Feb 22, 2005·7 cites·22 claims
- 0451US6995033B2Method of fabricating an optical semiconductor package and optical semiconductor boxST MICROELECTRONICS SA·Filed 2002·Granted Feb 7, 2006·6 cites·7 claims
- 0550US7288843B2Integrated circuit chip support substrate for placing in a mold, and associated methodST MICROELECTRONICS SA·Filed 2002·Granted Oct 30, 2007·5 cites·8 claims
- 0650US6759718B2Semiconductor package with a sensor having a fastening insertST MICROELECTRONICS SA·Filed 2002·Granted Jul 6, 2004·5 cites·22 claims
- 0738US2002101006A1Mould for injection-moulding a material for coating integrated circuit chips on a substrateST MICROELECTRONICS SA·Filed 2001·Application pending·0 cites
- 0834US7029952B2Method for making a semiconductor package and semiconductor package with integrated circuit chipsST MICROELECTRONICS SA·Filed 2002·Granted Apr 18, 2006·0 cites·7 claims
- 0934US6885088B2Flat leadframe for a semiconductor packageST MICROELECTRONICS SA·Filed 2003·Granted Apr 26, 2005·0 cites·24 claims
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