Inventor · disambiguated record
Huay Yann Tay
Also filed as: TAY HUAY YANN
2 granted patents·7 pending applications·3 citations·filing 2013–2024
42Inventor score
Files withTEXAS INSTRUMENTS INC9
Top patents by PatentIndex Score
9 records- 0161US9123626B1Integrated passive flip chip packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Sep 1, 2015·2 cites·16 claims
- 0258US11328984B2Multi-die integrated circuit packages and methods of manufacturing the sameTEXAS INSTRUMENTS INC·Filed 2017·Granted May 10, 2022·1 cites·16 claims
- 0355US2025309063A1Shaped die for semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0450US2024339382A1Molded package with an interchangeable leadframeTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0550US2024347425A1Integrated circuit package with multiple interconnectsTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0648US2024404973A1Wafer level process for semiconductor device packageTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0746US2015053586A1Carrier tapeTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
- 0845US2015262920A1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2014·Application pending·0 cites
- 0941US2017053883A1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →