Inventor · disambiguated record
David Chong
Also filed as: CHONG DAVID · CHONG DAVID C H
11 granted patents·5 pending applications·127 citations·filing 1982–2023
88Inventor score
Top patents by PatentIndex Score
16 records- 0190US6891257B2Packaging system for die-up connection of a die-down oriented integrated circuitFAIRCHILD SEMICONDUCTOR·Filed 2001·Granted May 10, 2005·79 cites·10 claims
- 0287US8664752B2Semiconductor die package and method for making the sameJEON OSEOB·Filed 2012·Granted Mar 4, 2014·9 cites·10 claims
- 0366US10916683B2Contact etching and metallization for improved LED device performance and reliabilityLUMILEDS LLC·Filed 2020·Granted Feb 9, 2021·0 cites·20 claims
- 0458US2025000025A1Rotary actuator system for work vehicleCNH IND AMERICA LLC·Filed 2023·Application pending·0 cites
- 0557US7579680B2Packaging system for semiconductor devicesFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Aug 25, 2009·1 cites·14 claims
- 0656US8525321B2Conductive chip disposed on lead semiconductor packageKUMAR JATINDER·Filed 2011·Granted Sep 3, 2013·1 cites·21 claims
- 0755US4621319APersonal development systemINTEL CORP·Filed 1982·Granted Nov 4, 1986·28 cites·8 claims
- 0854US9159656B2Semiconductor die package and method for making the sameFAIRCHILD SEMICONDUCTOR·Filed 2013·Granted Oct 13, 2015·0 cites·9 claims
- 0949US2013307134A1Conductive chip disposed on lead semiconductor package and methods of making the sameFAIRCHILD SEMICONDUCTOR·Filed 2013·Application pending·0 cites
- 1045US10529894B2Contact etching and metallization for improved LED device performance and reliabilityCHONG DAVID·Filed 2016·Granted Jan 7, 2020·0 cites·10 claims
- 1143US7323361B2Packaging system for semiconductor devicesFAIRCHILD SEMICONDUCTOR·Filed 2003·Granted Jan 29, 2008·1 cites·20 claims
- 1242US2011159864A1Electronic equipment mode switching apparatus and method based on skin contact, mobile phone for switching call incoming alarming mode on the basis of skin contact when call is received, and method of automatically switching call incoming alarming mode of the mobile phonePARK JUNE MIN·Filed 2010·Application pending·0 cites
- 1338US2005275089A1Package and method for packaging an integrated circuit dieJOSHI RAJEEV D·Filed 2004·Application pending·0 cites
- 1437US8110447B2Method of making and designing lead frames for semiconductor packagesLIM LAY YEAP·Filed 2008·Granted Feb 7, 2012·0 cites·7 claims
- 1536US2009189261A1Ultra-Thin Semiconductor PackageLIM LAY YEAP·Filed 2008·Application pending·0 cites
- 1631US4881192AOne-dimensional linear picture transformerPHILIPS CORP·Filed 1988·Granted Nov 14, 1989·8 cites·6 claims
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