Inventor · disambiguated record
Kazutaka Takagi
Also filed as: TAKAGI KAZUTAKA
63 granted patents·9 pending applications·248 citations·filing 2001–2017
98Inventor score
Top patents by PatentIndex Score
72 records- 0192US7741907B2Class-F power amplifier circuitTOSHIBA KK·Filed 2008·Granted Jun 22, 2010·26 cites·15 claims
- 0291US7851832B2Semiconductor deviceTOSHIBA KK·Filed 2008·Granted Dec 14, 2010·20 cites·20 claims
- 0390US7486157B2Package for high frequency waves containing high frequency electronic circuitTOSHIBA KK·Filed 2006·Granted Feb 3, 2009·20 cites·8 claims
- 0489US9935581B2High-frequency semiconductor amplifierTOSHIBA KK·Filed 2016·Granted Apr 3, 2018·7 cites·14 claims
- 0587US9536843B2Semiconductor package and semiconductor moduleTOSHIBA KK·Filed 2014·Granted Jan 3, 2017·8 cites·6 claims
- 0687US7990223B1High frequency module and operating method of the sameTOSHIBA KK·Filed 2010·Granted Aug 2, 2011·9 cites·22 claims
- 0785US8097906B2Semiconductor device having finger electrodesTAKAGI KAZUTAKA·Filed 2007·Granted Jan 17, 2012·13 cites·5 claims
- 0884US7411288B2Semiconductor deviceTOSHIBA KK·Filed 2005·Granted Aug 12, 2008·9 cites·8 claims
- 0983US9219017B2Radio frequency semiconductor device package and method for manufacturing same, and radio frequency semiconductor deviceTOSHIBA KK·Filed 2015·Granted Dec 22, 2015·4 cites·14 claims
- 1083US8610507B2Power amplifierNG CHOON YONG·Filed 2011·Granted Dec 17, 2013·8 cites·8 claims
- 1181US7576423B2Semiconductor deviceTOSHIBA KK·Filed 2008·Granted Aug 18, 2009·7 cites·6 claims
- 1280US9035469B2Semiconductor device that controls a negative resistive oscillation and obtains a high amplification outputTOSHIBA KK·Filed 2013·Granted May 19, 2015·5 cites·5 claims
- 1378US8154079B2Semiconductor device and fabrication method of the semiconductor deviceMATSUSHITA KEIICHI·Filed 2007·Granted Apr 10, 2012·8 cites·13 claims
- 1477US9013034B2Semiconductor packageTOSHIBA KK·Filed 2014·Granted Apr 21, 2015·4 cites·16 claims
- 1576US9357644B2Joined structural body of members, joining method of members, and package for containing an electronic componentTOSHIBA KK·Filed 2014·Granted May 31, 2016·3 cites·10 claims
- 1676US8022769B2Semiconductor deviceTOSHIBA KK·Filed 2010·Granted Sep 20, 2011·5 cites·18 claims
- 1776US7659613B2Semiconductor deviceTOSHIBA KK·Filed 2008·Granted Feb 9, 2010·5 cites·6 claims
- 1873US9947628B2High frequency semiconductor amplifierTOSHIBA KK·Filed 2016·Granted Apr 17, 2018·2 cites·8 claims
- 1973US9041190B2Semiconductor packageTOSHIBA KK·Filed 2014·Granted May 26, 2015·3 cites·4 claims
- 2073US8546852B2Semiconductor deviceTAKAGI KAZUTAKA·Filed 2008·Granted Oct 1, 2013·5 cites·12 claims
- 2173US8471382B2Package and high frequency terminal structure for the sameTAKAGI KAZUTAKA·Filed 2012·Granted Jun 25, 2013·3 cites·12 claims
- 2272US8786369B2High frequency amplifierTAKAGI KAZUTAKA·Filed 2012·Granted Jul 22, 2014·4 cites·7 claims
- 2372US8653896B2Class-AB power amplifierTAKAGI KAZUTAKA·Filed 2011·Granted Feb 18, 2014·3 cites·10 claims
- 2472US8604883B2Class-C power amplifierTAKAGI KAZUTAKA·Filed 2011·Granted Dec 10, 2013·3 cites·10 claims
- 2572US8345434B2High frequency circuit having multi-chip module structureTOSHIBA KK·Filed 2010·Granted Jan 1, 2013·3 cites·15 claims
- 2672US7605465B2Semiconductor device for high frequency power amplificationTOSHIBA KK·Filed 2005·Granted Oct 20, 2009·5 cites·16 claims
- 2771US9576737B2Parallel capacitor and high frequency semiconductor deviceTOSHIBA KK·Filed 2015·Granted Feb 21, 2017·2 cites·17 claims
- 2869US8431973B2High frequency semiconductor deviceTAKAGI KAZUTAKA·Filed 2009·Granted Apr 30, 2013·4 cites·28 claims
- 2968US9774298B2High-frequency amplifierTOSHIBA KK·Filed 2016·Granted Sep 26, 2017·2 cites·9 claims
- 3068US8026595B2Semiconductor device having hermitically sealed active area and electrodesTOSHIBA KK·Filed 2008·Granted Sep 27, 2011·3 cites·8 claims
- 3168US7888797B2High frequency package device with internal space having a resonant frequency offset from frequency usedTOSHIBA KK·Filed 2006·Granted Feb 15, 2011·4 cites·11 claims
- 3267US8115554B2Semiconductor deviceNG CHOON YOUNG·Filed 2011·Granted Feb 14, 2012·5 cites·2 claims
- 3367US7749901B2Method for forming a tapered via of a semiconductor deviceTOSHIBA KK·Filed 2007·Granted Jul 6, 2010·3 cites·3 claims
- 3466US10110185B2Microwave semiconductor deviceTOSHIBA KK·Filed 2017·Granted Oct 23, 2018·1 cites·7 claims
- 3566US8912647B2Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chipTAKAGI KAZUTAKA·Filed 2011·Granted Dec 16, 2014·2 cites·9 claims
- 3666US8278685B2Semiconductor device used with high frequency bandTAKAGI KAZUTAKA·Filed 2007·Granted Oct 2, 2012·3 cites·4 claims
- 3766US8106503B2High frequency semiconductor deviceTAKAGI KAZUTAKA·Filed 2010·Granted Jan 31, 2012·2 cites·15 claims
- 3864US7667322B2High-frequency semiconductor deviceTOSHIBA KK·Filed 2007·Granted Feb 23, 2010·2 cites·13 claims
- 3963US9712142B2High frequency semiconductor deviceTOSHIBA KK·Filed 2015·Granted Jul 18, 2017·2 cites·19 claims
- 4061US10116266B2Doherty amplifierTOSHIBA KK·Filed 2017·Granted Oct 30, 2018·1 cites·1 claims
- 4161US9035702B2Microwave semiconductor amplifierTAKAGI KAZUTAKA·Filed 2012·Granted May 19, 2015·1 cites·17 claims
- 4261US8759838B2Package and fabrication method of the sameTAKAGI KAZUTAKA·Filed 2011·Granted Jun 24, 2014·1 cites·13 claims
- 4360US8643438B2Class-AB power amplifierTAKAGI KAZUTAKA·Filed 2011·Granted Feb 4, 2014·2 cites·9 claims
- 4460US8222968B2Microstrip transmission line device including an offset resistive region extending between conductive layers and method of manufactureTAKAGI KAZUTAKA·Filed 2007·Granted Jul 17, 2012·2 cites·5 claims
- 4559US9590562B2Semiconductor amplifier bias circuit and semiconductor amplifier deviceTOSHIBA KK·Filed 2015·Granted Mar 7, 2017·1 cites·14 claims
- 4659US8159311B2High frequency package and manufacturing method thereofTAKAGI KAZUTAKA·Filed 2009·Granted Apr 17, 2012·1 cites·13 claims
- 4758US8357942B2Semiconductor device with a peripheral circuit formed thereinTOSHIBA KK·Filed 2007·Granted Jan 22, 2013·1 cites·8 claims
- 4858US8344462B2Mounting device for a semiconductor packageTOSHIBA KK·Filed 2007·Granted Jan 1, 2013·1 cites·6 claims
- 4956US6400035B1Microwave semiconductor device with improved heat discharge and electrical properties and manufacturing method thereofTOSHIBA KK·Filed 2001·Granted Jun 4, 2002·6 cites·9 claims
- 5054US7994637B2High-frequency semiconductor deviceTOSHIBA KK·Filed 2009·Granted Aug 9, 2011·0 cites·3 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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