Inventor · disambiguated record
Wen-Wei Shen
Also filed as: Shen wen-wei
15 granted patents·5 pending applications·131 citations·filing 2008–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD11Shen wen-wei4CHEN CHIH-HUA2TAIWAN SEMICONDUCTOR MFG2IND TECH RES INST1
Top patents by PatentIndex Score
20 records- 0197US11424219B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0297US7969013B2Through silicon via with dummy structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Jun 28, 2011·32 cites·10 claims
- 0396US9773755B2Substrate interconnections having different sizesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 26, 2017·16 cites·20 claims
- 0493US9142533B2Substrate interconnections having different sizesShen wen-wei·Filed 2010·Granted Sep 22, 2015·18 cites·19 claims
- 0593US8241963B2Recessed pillar structureShen wen-wei·Filed 2010·Granted Aug 14, 2012·18 cites·20 claims
- 0692US8901736B2Strength of micro-bump jointsShen wen-wei·Filed 2010·Granted Dec 2, 2014·15 cites·20 claims
- 0790US9768138B2Improving the strength of micro-bump jointsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Sep 19, 2017·6 cites·19 claims
- 0889US11502015B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 15, 2022·2 cites·20 claims
- 0984US8202800B2Method of forming through silicon via with dummy structureCHEN CHIH-HUA·Filed 2011·Granted Jun 19, 2012·6 cites·20 claims
- 1083US8653648B2Zigzag pattern for TSV copper adhesionCHEN CHIH-HUA·Filed 2008·Granted Feb 18, 2014·8 cites·18 claims
- 1179US2024387311A1Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1278US2024363587A1Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1377US9373564B2Semiconductor device, manufacturing method and stacking structure thereofIND TECH RES INST·Filed 2015·Granted Jun 21, 2016·3 cites·11 claims
- 1477US2025336889A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1575US12148678B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 1673US12080681B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 1768US2023378132A1Semiconductor package and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1866US8178970B2Strong interconnection post geometryShen wen-wei·Filed 2009·Granted May 15, 2012·3 cites·18 claims
- 1958US9219046B2Strength of micro-bump jointsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 22, 2015·0 cites·20 claims
- 2057US2025105169A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →