Inventor · disambiguated record
Ting-Hao Lin
Also filed as: LIN TING · LIN TING H · LIN TING-HAO
57 granted patents·28 pending applications·593 citations·filing 1994–2024
98Inventor score
Files withKINSUS INTERCONNECT TECH CORP51CHANG CHIEN-WEI16COMPEQ MANUFACTURING COMPANY L4IONETWORKS INC4KAYLU IND CORP3
Top patents by PatentIndex Score
85 records- 0195US11328535B1Motion identification method and systemIONETWORKS INC·Filed 2020·Granted May 10, 2022·17 cites·10 claims
- 0295US6864513B2Light emitting diode bulb having high heat dissipating efficiencyKAYLU IND CORP·Filed 2003·Granted Mar 8, 2005·292 cites·8 claims
- 0389US9831167B1Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Nov 28, 2017·7 cites·18 claims
- 0488US9439290B1Carrier board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·7 cites·4 claims
- 0588US9301405B1Method for manufacturing microthrough-hole in circuit board and circuit board structure with microthrough-holeKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Mar 29, 2016·10 cites·7 claims
- 0686US9439292B1Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structureKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Sep 6, 2016·9 cites·10 claims
- 0786US5830800APackaging method for a ball grid array integrated circuit without utilizing a base plateCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Nov 3, 1998·87 cites·7 claims
- 0885US9198296B1Double sided board with buried element and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Nov 24, 2015·7 cites·8 claims
- 0983US9901016B1Electromagnetic-interference shielding deviceKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Feb 20, 2018·3 cites·7 claims
- 1078US9847165B2Winged coil structure and method of manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2015·Granted Dec 19, 2017·2 cites·20 claims
- 1177US11328160B2Video condensation and recognition method and system thereofIONETWORKS INC·Filed 2020·Granted May 10, 2022·2 cites·16 claims
- 1277US5882957ABall grid array packaging method for an integrated circuit and structure realized by the methodCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Mar 16, 1999·53 cites·9 claims
- 1376US8051558B2Manufacturing method of the embedded passive deviceKINSUS INTERCONNECT TECH CORP·Filed 2008·Granted Nov 8, 2011·5 cites·6 claims
- 1476US7875809B2Method of fabricating board having high density core layer and structure thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Jan 25, 2011·8 cites·1 claims
- 1575US9406641B2Compound carrier board structure of flip-chip chip-scale package and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Aug 2, 2016·3 cites·8 claims
- 1672US10440837B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 8, 2019·1 cites·10 claims
- 1772US8377815B2Manufacturing method of a semiconductor load boardKINSUS INTERCONNECT TECH CORP·Filed 2011·Granted Feb 19, 2013·4 cites·12 claims
- 1872US8083954B2Method for fabricating component-embedded printed circuit boardCHANG CHIEN-WEI·Filed 2008·Granted Dec 27, 2011·5 cites·8 claims
- 1971US10383265B2Electromagnetic-interference shielding deviceKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Aug 13, 2019·1 cites·9 claims
- 2067US5884396ATransfer flat type ball grid array method for manufacturing packaging substrateCOMPEQ MANUFACTURING COMPANY L·Filed 1997·Granted Mar 23, 1999·35 cites·7 claims
- 2166US7871892B2Method for fabricating buried capacitor structureKINSUS INTERCONNECT TECH CORP·Filed 2009·Granted Jan 18, 2011·3 cites·3 claims
- 2264US10779418B2Manufacturing method of double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Sep 15, 2020·0 cites·18 claims
- 2363US10039185B2Manufacturing method of landless multilayer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Jul 31, 2018·1 cites·10 claims
- 2463US7488675B2Method for fabricating IC board without ring structureKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Feb 10, 2009·2 cites·4 claims
- 2562US10366822B2Method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Jul 30, 2019·0 cites·15 claims
- 2662US10170403B2Ameliorated compound carrier board structure of flip-chip chip-scale packageKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jan 1, 2019·2 cites·8 claims
- 2762US2025393119A1Anti-warpage carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 2862US2025393123A1Impact-resistant reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 2962US2025389754A1Test fixtureKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 3060US10256030B2Flexible plate adapted to be used in winged coil structure, winged coil structure, and method of manufacturing winged coil structureKINSUS INTERCONNECT TECH CORP·Filed 2017·Granted Apr 9, 2019·0 cites·9 claims
- 3160US8312624B1Method for manufacturing a heat dissipation structure of a printed circuit boardCHANG CHIEN-WEI·Filed 2011·Granted Nov 20, 2012·1 cites·4 claims
- 3260US2025247954A1Micro circuit structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2024·Application pending·0 cites
- 3360US2025079333A1Anti-warpage reinforced carrierKINSUS INTERCONNECT TECH CORP·Filed 2023·Application pending·0 cites
- 3459US11495390B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2019·Granted Nov 8, 2022·0 cites·10 claims
- 3559US6830496B2Method of fabricating light emitting diode device with multiple encapsulantsKAYLU IND CORP·Filed 2003·Granted Dec 14, 2004·11 cites·12 claims
- 3658US10104817B1Electromagnetic-interference shielding device and method for manufacturing the sameKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Oct 16, 2018·0 cites·11 claims
- 3758US7234230B1Composite circuit board and method for manufacturing the sameGOLD CIRCUIT ELECTRONICS LTD·Filed 2005·Granted Jun 26, 2007·1 cites·5 claims
- 3857US10779405B2Landless multilayer circuit board and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 15, 2020·0 cites·11 claims
- 3957US7573721B2Embedded passive device structure and manufacturing method thereofKINSUS INTERCONNECT TECH CORP·Filed 2007·Granted Aug 11, 2009·1 cites·7 claims
- 4056US10440836B2Double layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Oct 8, 2019·0 cites·3 claims
- 4156US10405423B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2018·Granted Sep 3, 2019·0 cites·14 claims
- 4255US2009111213A1High-Density Fine Line Structure And Method Of Manufacturing The SameCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 4354US9967975B2Multi-layer circuit boardKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted May 8, 2018·0 cites·13 claims
- 4454US8471375B2High-density fine line structure and method of manufacturing the sameCHANG CHIEN-WEI·Filed 2007·Granted Jun 25, 2013·0 cites·5 claims
- 4553US2009308527A1Method For Fabricating Circuit Trace On Core Board Having Buried HoleCHANG CHIEN-WEI·Filed 2008·Application pending·0 cites
- 4652US10256028B2Buildup board structureKINSUS INTERCONNECT TECH CORP·Filed 2016·Granted Apr 9, 2019·0 cites·10 claims
- 4751US9095084B2Stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·4 claims
- 4850US9370110B2Method of manufacturing a multilayer substrate structure for fine lineKINSUS INTERCONNECT TECH CORP·Filed 2014·Granted Jun 14, 2016·0 cites·7 claims
- 4950US2015282306A1Multilayer substrate structure for fine lineKINSUS INTERCONNECT TECH CORP·Filed 2014·Application pending·0 cites
- 5049US9095085B2Method of manufacturing a stacked multilayer structureKINSUS INTERCONNECT TECH CORP·Filed 2013·Granted Jul 28, 2015·0 cites·8 claims
Showing the top 50 of 85 patent records by PatentIndex Score.
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