Inventor · disambiguated record
Wen Chung Yang
Also filed as: YANG WEN · YANG WEN-CHUNG
6 granted patents·5 pending applications·12 citations·filing 2012–2025
73Inventor score
Files withSUN QINGQING4POWERCHIP SEMICONDUCTOR MFG CORP3E INK HOLDINGS INC2POWERCHIP TECH CORP1UNIV NORTH CHINA TECHNOLOGY1
Top patents by PatentIndex Score
11 records- 0185US11637017B2Method of forming memory devicePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2022·Granted Apr 25, 2023·1 cites·11 claims
- 0279US9153500B2Method for improving the electromigration resistance in the copper interconnection processSUN QINGQING·Filed 2012·Granted Oct 6, 2015·7 cites·2 claims
- 0377US9490349B1Method of manufacturing a semiconductor devicePOWERCHIP TECH CORP·Filed 2015·Granted Nov 8, 2016·4 cites·11 claims
- 0466US2025336374A1Display deviceE INK HOLDINGS INC·Filed 2025·Application pending·0 cites
- 0557US11424340B2Memory device and method of forming the samePOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Aug 23, 2022·0 cites·10 claims
- 0653US2025053039A1E-paper display panelE INK HOLDINGS INC·Filed 2024·Application pending·0 cites
- 0752US2025045500A1Method and system for predicting floating times of includsions during refininements of molten steelUNIV NORTH CHINA TECHNOLOGY·Filed 2024·Application pending·0 cites
- 0843US11063156B1Memory device and manufacturing method thereofPOWERCHIP SEMICONDUCTOR MFG CORP·Filed 2020·Granted Jul 13, 2021·0 cites·17 claims
- 0942US2013078761A1Method for manufacturing a flexible transparent 1t1r storage unit based on a completely low-temperature processSUN QINGQING·Filed 2012·Application pending·0 cites
- 1037US2013078797A1Method for manufacturing a copper-diffusion barrier layer used in nano integrated circuitSUN QINGQING·Filed 2012·Application pending·0 cites
- 1136US8455372B2Method for cleaning and passivating gallium arsenide surface autologous oxide and depositing AL203 dielectricSUN QINGQING·Filed 2012·Granted Jun 4, 2013·0 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →