Inventor · disambiguated record
Wen-Kun Yang
Also filed as: YANG WEN-KUN
53 granted patents·73 pending applications·1,125 citations·filing 2000–2015
99Inventor score
Files withADVANCED CHIP ENG TECH INC87YANG WEN-KUN23KING DRAGON INTERNAT INC6ADAVANCED CHIP ENGINEERING TEC1ADV CHIP ENG TECH INC1
Top patents by PatentIndex Score
126 records- 0198US7667318B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 23, 2010·56 cites·12 claims
- 0298US7339279B2Chip-size package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 4, 2008·71 cites·13 claims
- 0398US7196408B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2005·Granted Mar 27, 2007·84 cites·6 claims
- 0497US8237257B2Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the sameYANG WEN-KUN·Filed 2008·Granted Aug 7, 2012·48 cites·17 claims
- 0597US7262081B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2005·Granted Aug 28, 2007·55 cites·11 claims
- 0696US8350377B2Semiconductor device package structure and method for the sameYANG WEN-KUN·Filed 2010·Granted Jan 8, 2013·27 cites·17 claims
- 0796US8178963B2Wafer level package with die receiving through-hole and method of the sameYANG WEN-KUN·Filed 2007·Granted May 15, 2012·47 cites·8 claims
- 0896US8178964B2Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the sameYANG WEN-KUN·Filed 2007·Granted May 15, 2012·50 cites·12 claims
- 0996US7514767B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Apr 7, 2009·50 cites·18 claims
- 1096US7238602B2Chip-size package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2004·Granted Jul 3, 2007·92 cites·32 claims
- 1195US7655501B2Wafer level package with good CTE performanceADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 2, 2010·50 cites·10 claims
- 1295US7501310B2Structure of image sensor module and method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 10, 2009·33 cites·27 claims
- 1394US7812434B2Wafer level package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Oct 12, 2010·31 cites·9 claims
- 1494US7557437B2Fan out type wafer level package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jul 7, 2009·25 cites·18 claims
- 1593US8299488B2LED chipYANG WEN-KUN·Filed 2010·Granted Oct 30, 2012·9 cites·9 claims
- 1692US7459781B2Fan out type wafer level package structure and method of the sameYANG WEN-KUN·Filed 2003·Granted Dec 2, 2008·52 cites·18 claims
- 1792US7061106B2Structure of image sensor module and a method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2004·Granted Jun 13, 2006·55 cites·19 claims
- 1891US7453148B2Structure of dielectric layers in built-up layers of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Nov 18, 2008·32 cites·18 claims
- 1989US8106504B2Stacking package structure with chip embedded inside and die having through silicon via and method of the sameYANG WEN-KUN·Filed 2009·Granted Jan 31, 2012·15 cites·20 claims
- 2089US7279782B2FBGA and COB package structure for image sensorADVANCED CHIP ENG TECH INC·Filed 2005·Granted Oct 9, 2007·21 cites·25 claims
- 2188US8115297B2Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the sameYANG WEN-KUN·Filed 2009·Granted Feb 14, 2012·12 cites·15 claims
- 2288US7459729B2Semiconductor image device package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Dec 2, 2008·16 cites·11 claims
- 2387US7911044B2RF module package for releasing stressADVANCED CHIP ENG TECH INC·Filed 2006·Granted Mar 22, 2011·18 cites·8 claims
- 2487US7423335B2Sensor module package structure and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Sep 9, 2008·15 cites·19 claims
- 2585US7525185B2Semiconductor device package having multi-chips with side-by-side configuration and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Apr 28, 2009·14 cites·16 claims
- 2683US7566854B2Image sensor moduleADVANCED CHIP ENG TECH INC·Filed 2006·Granted Jul 28, 2009·7 cites·19 claims
- 2782US7335870B1Method for image sensor protectionADVANCED CHIP ENG TECH INC·Filed 2006·Granted Feb 26, 2008·11 cites·8 claims
- 2879US7176567B2Semiconductor device protective structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2005·Granted Feb 13, 2007·10 cites·8 claims
- 2978US7342296B2Wafer street buffer layerADVANCED CHIP ENG TECH INC·Filed 2005·Granted Mar 11, 2008·8 cites·10 claims
- 3078US7319043B2Method and system of trace pull testADVANCED CHIP ENG TECH INC·Filed 2005·Granted Jan 15, 2008·9 cites·14 claims
- 3175US8236608B2Stacking package structure with chip embedded inside and die having through silicon via and method of the sameYANG WEN-KUN·Filed 2011·Granted Aug 7, 2012·3 cites·4 claims
- 3274US7763494B2Semiconductor device package with multi-chips and method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Jul 27, 2010·5 cites·21 claims
- 3373US7446546B2Method and system of trace pull testADVANCED CHIP ENG TECH INC·Filed 2007·Granted Nov 4, 2008·7 cites·7 claims
- 3471US7416920B2Semiconductor device protective structure and method for fabricating the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Aug 26, 2008·5 cites·12 claims
- 3569US7687923B2Semiconductor device package having a back side protective schemeADVANCED CHIP ENG TECH INC·Filed 2007·Granted Mar 30, 2010·4 cites·10 claims
- 3668US7498556B2Image sensor module having build-in package cavity and the method of the sameADAVANCED CHIP ENGINEERING TEC·Filed 2007·Granted Mar 3, 2009·6 cites·15 claims
- 3768US6352868B1Method and apparatus for wafer level burn-inFiled 2000·Granted Mar 5, 2002·13 cites·17 claims
- 3867US8232633B2Image sensor package with dual substrates and the method of the sameYANG WEN-KUN·Filed 2011·Granted Jul 31, 2012·2 cites·15 claims
- 3966US7476565B2Method for forming filling paste structure of WL packageADVANCED CHIP ENG TECH INC·Filed 2007·Granted Jan 13, 2009·3 cites·16 claims
- 4066US6557244B1Wafer level board/card assembly apparatusFiled 2000·Granted May 6, 2003·10 cites·11 claims
- 4165US8304287B2Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the sameYANG WEN-KUN·Filed 2011·Granted Nov 6, 2012·1 cites·5 claims
- 4263US7468544B2Structure and process for WL-CSP with metal coverADVANCED CHIP ENG TECH INC·Filed 2006·Granted Dec 23, 2008·2 cites·19 claims
- 4361US9379081B2Semiconductor device package and method of the sameKING DRAGON INTERNAT INC·Filed 2014·Granted Jun 28, 2016·1 cites·3 claims
- 4460US7863105B2Image sensor package and forming method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Jan 4, 2011·0 cites·8 claims
- 4560US7498646B2Structure of image sensor module and a method for manufacturing of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Mar 3, 2009·1 cites·19 claims
- 4659US7525139B2Image sensor with a protection layerADVANCED CHIP ENG TECH INC·Filed 2004·Granted Apr 28, 2009·7 cites·8 claims
- 4759US6818475B2Wafer level package and the process of the sameFiled 2003·Granted Nov 16, 2004·15 cites·12 claims
- 4858US9117941B2LED package and method of the sameKING DRAGON INTERNAT INC·Filed 2014·Granted Aug 25, 2015·1 cites·9 claims
- 4957US7224061B2Package structureADVANCED CHIP ENG TECH INC·Filed 2004·Granted May 29, 2007·8 cites·14 claims
- 5057US2008274579A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
Showing the top 50 of 126 patent records by PatentIndex Score.
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