Inventor · disambiguated record
Brad Banister
Also filed as: BANISTER BRAD
4 granted patents·1 pending application·8 citations·filing 1999–2003
69Inventor score
Top patents by PatentIndex Score
5 records- 0151US6319811B1Bond ply structure and associated process for interconnection of circuit layer pairs with conductive inksFiled 2000·Granted Nov 20, 2001·4 cites·10 claims
- 0247US6576839B1Bond-ply structure for interconnection of circuit layer pairs with conductive inksHONEYWELL INT INC·Filed 2001·Granted Jun 10, 2003·2 cites·8 claims
- 0343US6607939B2Method of making a multi-layer interconnectHONEYWELL INT INC·Filed 2001·Granted Aug 19, 2003·1 cites·4 claims
- 0434US2004124534A1Multi-layer interconnectFiled 2003·Application pending·0 cites
- 0529US6388325B2Multi-layer interconnectALLIED SIGNAL INC·Filed 1999·Granted May 14, 2002·1 cites·14 claims
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