Inventor · disambiguated record
Jungsuk Goh
Also filed as: GOH JUNGSUK
2 granted patents·1 pending application·1 citations·filing 2019–2022
32Inventor score
Technology areasH10P
Files withSEMES CO LTD3
Top patents by PatentIndex Score
3 records- 0168US11600593B2Die bonding apparatus and method and substrate bonding apparatus and methodSEMES CO LTD·Filed 2019·Granted Mar 7, 2023·1 cites·16 claims
- 0262US12046466B2Method and apparatus for treating substrateSEMES CO LTD·Filed 2022·Granted Jul 23, 2024·0 cites·13 claims
- 0353US2021050210A1Method and apparatus for treating substrateSEMES CO LTD·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →