Inventor · disambiguated record
Shingo Komatsu
Also filed as: KOMATSU SHINGO
28 granted patents·1 pending application·1,212 citations·filing 1996–2011
97Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD15PANASONIC CORP9HIRANO KOICHI1ICHIRYU TAKASHI1KARASHIMA SEIJI1
Top patents by PatentIndex Score
29 records- 0199US6734542B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 11, 2004·347 cites·34 claims
- 0298US7294587B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Nov 13, 2007·64 cites·10 claims
- 0398US6784530B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Aug 31, 2004·169 cites·11 claims
- 0497US6975516B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 13, 2005·110 cites·26 claims
- 0597US6489685B2Component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 3, 2002·111 cites·24 claims
- 0695US7198996B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 3, 2007·31 cites·2 claims
- 0795US7018866B2Circuit component built-in module with embedded semiconductor chip and method of manufacturingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Mar 28, 2006·83 cites·15 claims
- 0895US6871396B2Transfer material for wiring substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 29, 2005·69 cites·22 claims
- 0994US6855892B2Insulation sheet, multi-layer wiring substrate and production processes thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 15, 2005·62 cites·44 claims
- 1092US6939738B2Component built-in module and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 6, 2005·56 cites·3 claims
- 1188US7611040B2Method for forming solder bump and method for mounting semiconductor device using a solder powder resin compositionPANASONIC CORP·Filed 2006·Granted Nov 3, 2009·13 cites·12 claims
- 1287US6955948B2Method of manufacturing a component built-in moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Oct 18, 2005·33 cites·19 claims
- 1380US6936774B2Wiring substrate produced by transfer material methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 30, 2005·17 cites·15 claims
- 1476US7713787B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted May 11, 2010·4 cites·10 claims
- 1576US7157789B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 2, 2007·7 cites·30 claims
- 1672US8039307B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2010·Granted Oct 18, 2011·2 cites·19 claims
- 1770US7888789B2Transfer material used for producing a wiring substratePANASONIC CORP·Filed 2005·Granted Feb 15, 2011·2 cites·13 claims
- 1869US7911064B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·4 cites·13 claims
- 1966US7921551B2Electronic component mounting methodPANASONIC CORP·Filed 2006·Granted Apr 12, 2011·4 cites·13 claims
- 2058US5915280AElectromagnetic flowmeterYAMATAKE CORP·Filed 1996·Granted Jun 22, 1999·23 cites·4 claims
- 2152US7851281B2Manufacturing method of flexible semiconductor device and flexible semiconductor devicePANASONIC CORP·Filed 2008·Granted Dec 14, 2010·0 cites·20 claims
- 2252US7390692B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jun 24, 2008·0 cites·24 claims
- 2348US8344264B2Semiconductor device and manufacturing process thereofPANASONIC CORP·Filed 2009·Granted Jan 1, 2013·0 cites·7 claims
- 2447US7977741B2Manufacturing method of flexible semiconductor device and flexible semiconductor devicePANASONIC CORP·Filed 2010·Granted Jul 12, 2011·0 cites·4 claims
- 2547US7132756B2Semiconductor device and method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Nov 7, 2006·1 cites·12 claims
- 2646US8617943B2Method for making a semiconductor device on a flexible substrateICHIRYU TAKASHI·Filed 2009·Granted Dec 31, 2013·0 cites·12 claims
- 2741US8709293B2Flip-chip mounting resin composition and bump forming resin compositionKITAE TAKASHI·Filed 2005·Granted Apr 29, 2014·0 cites·17 claims
- 2838US8871567B2Field-effect transistor and method for manufacturing the sameHIRANO KOICHI·Filed 2011·Granted Oct 28, 2014·0 cites·21 claims
- 2934US2006091524A1Semiconductor module, process for producing the same, and film interposerKARASHIMA SEIJI·Filed 2005·Application pending·0 cites
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