Inventor · disambiguated record
Marc Huan
Also filed as: HUAN MARC
2 granted patents·6 citations·filing 2000–2001
51Inventor score
Technology areasH10W
Files withCIT ALCATEL2
Top patents by PatentIndex Score
2 records- 0144US6754405B2Electronic assembly having high interconnection densityCIT ALCATEL·Filed 2001·Granted Jun 22, 2004·4 cites·22 claims
- 0235US6683373B1Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained therebyCIT ALCATEL·Filed 2000·Granted Jan 27, 2004·2 cites·15 claims
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