Inventor · disambiguated record
Ying-Lang Wang
Also filed as: WANG YING · WANG YING-LANG
157 granted patents·35 pending applications·1,529 citations·filing 1997–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG89TAIWAN SEMICONDUCTOR MFG CO LTD64CHANG SHIH-CHIEH7JANGJIAN SHIU-KO5CHEN KEI-WEI3
Top patents by PatentIndex Score
192 records- 0197US10347762B1Field effect transistor contact with reduced contact resistance using implantation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·20 cites·20 claims
- 0297US10058974B1Method for controlling chemical mechanical polishing processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·10 cites·20 claims
- 0396US11257952B2Source/drain structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 22, 2022·3 cites·20 claims
- 0496US10658510B2Source/drain structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·9 cites·20 claims
- 0596US6136680AMethods to improve copper-fluorinated silica glass interconnectsTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 24, 2000·133 cites·35 claims
- 0694US6673661B1Self-aligned method for forming dual gate thin film transistor (TFT) deviceTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 6, 2004·96 cites·13 claims
- 0793US10516106B2Electrode structure to improve RRAM performanceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·7 cites·20 claims
- 0893US9024369B2Metal shield structure and methods for BSI image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 5, 2015·8 cites·20 claims
- 0993US7837841B2Apparatuses for electrochemical deposition, conductive layer, and fabrication methods thereofTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Nov 23, 2010·45 cites·9 claims
- 1091US7359759B2Method and system for virtual metrology in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Apr 15, 2008·46 cites·7 claims
- 1191US2025366087A1Method for manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1290US11855146B2Melt anneal source and drain regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
- 1390US6291872B1Three-dimensional type inductor for mixed mode radio frequency deviceTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 18, 2001·99 cites·19 claims
- 1489US9812569B2Semiconductor device and fabricating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 7, 2017·6 cites·4 claims
- 1589US6670274B1Method of forming a copper damascene structure comprising a recessed copper-oxide-free initial copper structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 30, 2003·37 cites·51 claims
- 1688US9064770B2Methods for minimizing edge peeling in the manufacturing of BSI chipsKUO CHUN-TING·Filed 2012·Granted Jun 23, 2015·10 cites·22 claims
- 1787US9847478B2Methods and apparatus for resistive random access memory (RRAM)CHANG TING-CHANG·Filed 2012·Granted Dec 19, 2017·6 cites·20 claims
- 1887US9368394B1Dry etching gas and method of manufacturing semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted Jun 14, 2016·6 cites·20 claims
- 1987US8247322B2Via/contact and damascene structures and manufacturing methods thereofCHANG SHIH-CHIEH·Filed 2007·Granted Aug 21, 2012·14 cites·16 claims
- 2087US6291331B1Re-deposition high compressive stress PECVD oxide film after IMD CMP process to solve more than 5 metal stack via process IMD crack issueTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 18, 2001·111 cites·21 claims
- 2187US2025366098A1Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2286US10643892B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 5, 2020·3 cites·20 claims
- 2385US11211289B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 28, 2021·2 cites·20 claims
- 2485US6046112AChemical mechanical polishing slurryTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Apr 4, 2000·57 cites·12 claims
- 2584US12464790B2Semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Nov 4, 2025·0 cites·20 claims
- 2684US11955553B2Source/drain structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 2784US11227918B2Melt anneal source and drain regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 18, 2022·2 cites·21 claims
- 2884US8890273B2Methods and apparatus for an improved reflectivity optical grid for image sensorsJANGJIAN SHIU-KO·Filed 2012·Granted Nov 18, 2014·3 cites·15 claims
- 2984US8772899B2Method and apparatus for backside illumination sensorJANGJIAN SHIU-KO·Filed 2012·Granted Jul 8, 2014·3 cites·20 claims
- 3084US8518819B2Semiconductor device contact structures and methods for making the sameCHANG SHIH CHIEH·Filed 2011·Granted Aug 27, 2013·5 cites·16 claims
- 3184US6784077B1Shallow trench isolation processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·47 cites·21 claims
- 3284US6099662AProcess for cleaning a semiconductor substrate after chemical-mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Aug 8, 2000·77 cites·42 claims
- 3383US12068195B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 20, 2024·0 cites·20 claims
- 3483US9281475B2Resistive random-access memory (RRAM) with multi-layer device structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Mar 8, 2016·4 cites·20 claims
- 3583US9252180B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 2, 2016·5 cites·20 claims
- 3682US8735255B2Method of manufacturing semiconductor deviceHSIAO WEN CHU·Filed 2012·Granted May 27, 2014·6 cites·20 claims
- 3781US9871100B2Trench structure of semiconductor device having uneven nitrogen distribution linerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jan 16, 2018·2 cites·20 claims
- 3881US6790778B1Method for capping over a copper layerTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Sep 14, 2004·36 cites·28 claims
- 3980US9570311B2Modular grinding apparatuses and methods for wafer thinningKUO CHUN-TING·Filed 2012·Granted Feb 14, 2017·5 cites·20 claims
- 4080US6479098B1Method to solve particle performance of FSG layer by using UFU season film for FSG processTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Nov 12, 2002·20 cites·21 claims
- 4179US10096672B2Semiconductor device having barrier layer to prevent impurity diffusionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 9, 2018·2 cites·20 claims
- 4279US8435893B1Semiconductor device and method of formationNIAN JUN-NAN·Filed 2011·Granted May 7, 2013·6 cites·13 claims
- 4378US11594636B2Source/drain structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 28, 2023·0 cites·20 claims
- 4478US11011566B2Bonding pad on a back side illuminated image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 18, 2021·2 cites·20 claims
- 4578US6828226B1Removal of SiON residue after CMPTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 7, 2004·24 cites·28 claims
- 4677US11710659B2Metal loss prevention using implantationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4777US10868178B2Field effect transistor contact with reduced contact resistance using implantation processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 4877US10854713B2Method for forming trench structure of semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 1, 2020·1 cites·20 claims
- 4977US9728598B2Semiconductor device having barrier layer to prevent impurity diffusionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 8, 2017·2 cites·17 claims
- 5077US9676114B2Wafer edge trim blade with slotsKUO CHUN-TING·Filed 2012·Granted Jun 13, 2017·5 cites·19 claims
Showing the top 50 of 192 patent records by PatentIndex Score.
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