Inventor · disambiguated record
Shih-Chi Lin
Also filed as: LIN SHIH-CHI
42 granted patents·14 pending applications·880 citations·filing 1999–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG33TAIWAN SEMICONDUCTOR MFG CO LTD17ASUSTEK COMP INC1ELAN MICROELECTRONICS CORP1LAI MING-IU1
Top patents by PatentIndex Score
56 records- 0195US11670553B2Gate stack treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·2 cites·20 claims
- 0293US10357867B2Polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 23, 2019·8 cites·20 claims
- 0393US7274353B2Capacitive touchpad integrated with key and handwriting functionsELAN MICROELECTRONICS CORP·Filed 2003·Granted Sep 25, 2007·102 cites·12 claims
- 0492US6287962B1Method for making a novel graded silicon nitride/silicon oxide (SNO) hard mask for improved deep sub-micrometer semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Sep 11, 2001·54 cites·12 claims
- 0590US6077733AMethod of manufacturing self-aligned T-shaped gate through dual damasceneTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 20, 2000·115 cites·10 claims
- 0687US6518200B2Graded composite layer and method for fabrication thereofTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Feb 11, 2003·39 cites·15 claims
- 0787US6130151AMethod of manufacturing air gap in multilevel interconnectionTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Oct 10, 2000·83 cites·35 claims
- 0886US7635651B2Method of smoothening dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 22, 2009·12 cites·20 claims
- 0985US9589892B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 7, 2017·4 cites·20 claims
- 1085US5950094AMethod for fabricating fully dielectric isolated silicon (FDIS)TAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Sep 7, 1999·94 cites·16 claims
- 1184US6784077B1Shallow trench isolation processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Aug 31, 2004·47 cites·21 claims
- 1283US12300549B2Gate stack treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 1382US9718164B2Polishing system and polishing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2012·Granted Aug 1, 2017·4 cites·20 claims
- 1482US6211057B1Method for manufacturing arch air gap in multilevel interconnectionTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 3, 2001·67 cites·9 claims
- 1582US2025241055A1Gate stack treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1680US9966304B2Method for forming interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 8, 2018·3 cites·20 claims
- 1780US9385080B2Interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jul 5, 2016·4 cites·20 claims
- 1878US11088029B2Gate stack treatmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·1 cites·20 claims
- 1978US7851358B2Low temperature method for minimizing copper hillock defectsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 14, 2010·8 cites·20 claims
- 2078US6429538B1Method for making a novel graded silicon nitride/silicon oxide (SNO) hard mask for improved deep sub-micrometer semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 6, 2002·18 cites·5 claims
- 2178US2025349609A1Etch stop layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2276US6815007B1Method to solve IMD-FSG particle and increase Cp yield by using a new tougher UFUN season filmTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Nov 9, 2004·14 cites·24 claims
- 2375US6573189B1Manufacture method of metal bottom ARCTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jun 3, 2003·17 cites·17 claims
- 2474US6436791B1Method of manufacturing a very deep STI (shallow trench isolation)TAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 20, 2002·23 cites·25 claims
- 2573US6660638B1CMP process leaving no residual oxide layer or slurry particlesTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Dec 9, 2003·13 cites·3 claims
- 2671US2025105055A1Etch stop layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2769US6472719B1Method of manufacturing air gap in multilevel interconnectionTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 29, 2002·14 cites·2 claims
- 2868US9601593B2Semiconductor device structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 21, 2017·2 cites·20 claims
- 2964US11358252B2Method of using a polishing systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 14, 2022·0 cites·20 claims
- 3063US6585826B2Semiconductor wafer cleaning method to remove residual contamination including metal nitride particlesTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 1, 2003·10 cites·7 claims
- 3162US12079414B2Method for driving touch panel and related touch control circuitNOVATEK MICROELECTRONICS CORP·Filed 2021·Granted Sep 3, 2024·0 cites·7 claims
- 3261US7183199B2Method of reducing the pattern effect in the CMP processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 27, 2007·10 cites·7 claims
- 3360US7611589B2Methods of spin-on wafer cleaningTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Nov 3, 2009·1 cites·14 claims
- 3460US7368383B2Hillock reduction in copper filmsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 6, 2008·1 cites·15 claims
- 3560US6069063AMethod to form polysilicon resistors shielded from hydrogen intrusionTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted May 30, 2000·25 cites·20 claims
- 3659US6268267B1Silicon-oxynitride-oxide (SXO) continuity film pad to recessed bird's beak of LOCOSTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Jul 31, 2001·9 cites·5 claims
- 3759US6171978B1Method of manufacturing capacitor dielectricTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jan 9, 2001·27 cites·9 claims
- 3858US6372645B1Methods to reduce metal bridges and line shorts in integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 16, 2002·22 cites·22 claims
- 3958US2025226322A1Interconnect layer with different dielectric regionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4057US2025022925A1Methods Of Forming Contact Structure In Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4157US2025014946A1Cut Metal Gate Refill With Buffer LayerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4254US6218314B1Silicon dioxide-oxynitride continuity film as a passivation filmTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Apr 17, 2001·19 cites·16 claims
- 4353US7125802B2CMP process leaving no residual oxide layer or slurry particlesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 24, 2006·3 cites·4 claims
- 4453US2022207544A1Poi tracking analysis system and people flow systemSPATIAL TOPOLOGY CO LTD·Filed 2021·Application pending·0 cites
- 4548US9287153B2Semiconductor baking apparatus and operation method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 15, 2016·0 cites·20 claims
- 4648US2015001720A1Interconnect Structure and Method for Forming Interconnect StructureTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
- 4744US2020189447A1Guillotine-style headlight dimmer switching deviceTOPOWER CO LTD·Filed 2018·Application pending·0 cites
- 4842US6903019B2CMP process leaving no residual oxide layer or slurry particlesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 7, 2005·0 cites·4 claims
- 4941US2014369625A1Image processing methodASUSTEK COMP INC·Filed 2014·Application pending·0 cites
- 5040US2014264872A1Metal Capping Layer for Interconnect ApplicationsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Application pending·0 cites
Showing the top 50 of 56 patent records by PatentIndex Score.
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