Inventor · disambiguated record
James Dietz
Also filed as: DIETZ JAMES · DIETZ JAMES J
8 granted patents·2 pending applications·120 citations·filing 2002–2010
86Inventor score
Top patents by PatentIndex Score
10 records- 0187US7119567B2System and method for testing one or more dies on a semiconductor waferINFINEON TECHNOLOGIES CORP·Filed 2002·Granted Oct 10, 2006·29 cites·15 claims
- 0287US6847232B2Interchangeable CML/LVDS data transmission circuitTEXAS INSTRUMENTS INC·Filed 2002·Granted Jan 25, 2005·58 cites·16 claims
- 0382US7449909B2System and method for testing one or more dies on a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2007·Granted Nov 11, 2008·11 cites·6 claims
- 0478US7242208B2System and method for testing one or more dies on a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jul 10, 2007·7 cites·6 claims
- 0564US6888365B2Semiconductor wafer testing systemINFINEON TECHNOLOGIES CORP·Filed 2002·Granted May 3, 2005·11 cites·17 claims
- 0662US7518231B2Differential chip performance within a multi-chip packageINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 14, 2009·4 cites·9 claims
- 0747US2010218409A1Frame saverDIETZ JAMES J·Filed 2010·Application pending·0 cites
- 0834US2004051550A1Semiconductor die isolation systemFiled 2002·Application pending·0 cites
- 0932US7305594B2Integrated circuit in a maximum input/output configurationINFINEON TECHNOLOGIES AG·Filed 2002·Granted Dec 4, 2007·0 cites·22 claims
- 1032US6702589B1Leadless socket for decapped semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2002·Granted Mar 9, 2004·0 cites·20 claims
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