Inventor · disambiguated record
Kwong Hon Wong
Also filed as: WONG KWONG H · WONG KWONG HON KEITH · WONG KWONG-HON
70 granted patents·11 pending applications·2,148 citations·filing 1991–2012
99Inventor score
Files withIBM71CLEVENGER LAWRENCE A2INFINEON TECHNOLOGIES AG2ADVANCED MICRO DEVICES INC1GIEWONT KENNETH J1
Top patents by PatentIndex Score
81 records- 0197US6921711B2Method for forming metal replacement gate of high performanceIBM·Filed 2003·Granted Jul 26, 2005·147 cites·25 claims
- 0296US8481415B2Self-aligned contact combined with a replacement metal gate/high-K gate dielectricYUAN JUN·Filed 2010·Granted Jul 9, 2013·28 cites·15 claims
- 0396US5516412AVertical paddle plating cellIBM·Filed 1995·Granted May 14, 1996·394 cites·21 claims
- 0496US5209817ASelective plating method for forming integral via and wiring layersIBM·Filed 1991·Granted May 11, 1993·297 cites·10 claims
- 0595US7657995B2Method of fabricating a microelectromechanical system (MEMS) switchIBM·Filed 2007·Granted Feb 9, 2010·29 cites·4 claims
- 0695US6890810B2Method of fabrication of thin film resistor with zero TCRIBM·Filed 2003·Granted May 10, 2005·49 cites·7 claims
- 0794US6399490B1Highly conformal titanium nitride deposition process for high aspect ratio structuresIBM·Filed 2000·Granted Jun 4, 2002·104 cites·22 claims
- 0893US6777761B2Semiconductor chip using both polysilicon and metal gate devicesIBM·Filed 2002·Granted Aug 17, 2004·72 cites·22 claims
- 0993US6720595B2Three-dimensional island pixel photo-sensorIBM·Filed 2001·Granted Apr 13, 2004·59 cites·19 claims
- 1092US7348870B2Structure and method of fabricating a hinge type MEMS switchIBM·Filed 2005·Granted Mar 25, 2008·21 cites·13 claims
- 1192US7279413B2High-temperature stable gate structure with metallic electrodeIBM·Filed 2004·Granted Oct 9, 2007·53 cites·13 claims
- 1291US5458520AMethod for producing planar field emission structureIBM·Filed 1994·Granted Oct 17, 1995·86 cites·18 claims
- 1390US6723600B2Method for making a metal-insulator-metal capacitor using plate-through mask techniquesIBM·Filed 2001·Granted Apr 20, 2004·49 cites·8 claims
- 1489US7105445B2Interconnect structures with encasing cap and methods of making thereofIBM·Filed 2005·Granted Sep 12, 2006·11 cites·24 claims
- 1588US7462527B2Method of forming nitride films with high compressive stress for improved PFET device performanceIBM·Filed 2005·Granted Dec 9, 2008·14 cites·16 claims
- 1688US7041525B2Three-dimensional island pixel photo-sensorIBM·Filed 2004·Granted May 9, 2006·35 cites·15 claims
- 1787US7683418B2High-temperature stable gate structure with metallic electrodeIBM·Filed 2008·Granted Mar 23, 2010·10 cites·5 claims
- 1886US6709562B1Method of making electroplated interconnection structures on integrated circuit chipsIBM·Filed 1999·Granted Mar 23, 2004·90 cites·49 claims
- 1984US6958522B2Method to fabricate passive components using conductive polymerIBM·Filed 2001·Granted Oct 25, 2005·27 cites·24 claims
- 2084US6388327B1Capping layer for improved silicide formation in narrow semiconductor structuresIBM·Filed 2001·Granted May 14, 2002·31 cites·6 claims
- 2184US5534466AMethod of making area direct transfer multilayer thin film structureIBM·Filed 1995·Granted Jul 9, 1996·76 cites·19 claims
- 2283US6787836B2Integrated metal-insulator-metal capacitor and metal gate transistorIBM·Filed 2002·Granted Sep 7, 2004·26 cites·12 claims
- 2382US6444516B1Semi-insulating diffusion barrier for low-resistivity gate conductorsIBM·Filed 2000·Granted Sep 3, 2002·31 cites·20 claims
- 2481US7282802B2Modified via bottom structure for reliability enhancementIBM·Filed 2004·Granted Oct 16, 2007·24 cites·19 claims
- 2580US6436760B1Method for reducing surface oxide in polysilicon processingIBM·Filed 2001·Granted Aug 20, 2002·23 cites·19 claims
- 2677US7521345B2High-temperature stable gate structure with metallic electrodeIBM·Filed 2007·Granted Apr 21, 2009·5 cites·2 claims
- 2777US6909145B2Metal spacer gate for CMOS FETIBM·Filed 2002·Granted Jun 21, 2005·21 cites·28 claims
- 2877US6734097B2Liner with poor step coverage to improve contact resistance in W contactsINFINEON TECHNOLOGIES AG·Filed 2001·Granted May 11, 2004·27 cites·14 claims
- 2976US6960831B2Semiconductor device having a composite layer in addition to a barrier layer between copper wiring and aluminum bond padIBM·Filed 2003·Granted Nov 1, 2005·25 cites·12 claims
- 3076US6946716B2Electroplated interconnection structures on integrated circuit chipsIBM·Filed 2004·Granted Sep 20, 2005·16 cites·27 claims
- 3175US6432725B1Methods for crystallizing metallic oxide dielectric films at low temperatureINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 13, 2002·17 cites·27 claims
- 3274US7101784B2Method to generate porous organic dielectricIBM·Filed 2005·Granted Sep 5, 2006·5 cites·20 claims
- 3374US6387790B1Conversion of amorphous layer produced during IMP Ti depositionIBM·Filed 2000·Granted May 14, 2002·19 cites·19 claims
- 3472US7088074B2System level device for battery and integrated circuit integrationIBM·Filed 2002·Granted Aug 8, 2006·18 cites·20 claims
- 3571US7528065B2Structure and method for MOSFET gate electrode landing padIBM·Filed 2006·Granted May 5, 2009·4 cites·1 claims
- 3670US6620657B2Method of forming a planar polymer transistor using substrate bonding techniquesIBM·Filed 2002·Granted Sep 16, 2003·12 cites·17 claims
- 3770US6539625B2Chromium adhesion layer for copper vias in low-k technologyIBM·Filed 2001·Granted Apr 1, 2003·17 cites·9 claims
- 3870US6383929B1Copper vias in low-k technologyIBM·Filed 2001·Granted May 7, 2002·17 cites·5 claims
- 3969USD730331SPole mount for communication deviceWONG KWONG HON·Filed 2012·Granted May 26, 2015·23 cites·1 claims
- 4069US6967416B2Shared on-chip decoupling capacitor and heat-sink devicesIBM·Filed 2002·Granted Nov 22, 2005·16 cites·36 claims
- 4168US7488677B2Interconnect structures with encasing cap and methods of making thereofIBM·Filed 2006·Granted Feb 10, 2009·2 cites·1 claims
- 4268US6528383B1Simultaneous formation of deep trench capacitor and resistorIBM·Filed 2001·Granted Mar 4, 2003·14 cites·7 claims
- 4367US6417567B1Flat interface for a metal-silicon contract barrier filmIBM·Filed 2000·Granted Jul 9, 2002·8 cites·20 claims
- 4465US6022801AMethod for forming an atomically flat interface for a highly disordered metal-silicon barrier filmIBM·Filed 1998·Granted Feb 8, 2000·23 cites·18 claims
- 4564US7023528B2Hybrid electronic maskIBM·Filed 2002·Granted Apr 4, 2006·7 cites·11 claims
- 4663US6664576B1Polymer thin-film transistor with contact etch stopsIBM·Filed 2002·Granted Dec 16, 2003·7 cites·18 claims
- 4762US7193500B2Thin film resistors of different materialsIBM·Filed 2004·Granted Mar 20, 2007·4 cites·20 claims
- 4861US7906428B2Modified via bottom structure for reliability enhancementIBM·Filed 2008·Granted Mar 15, 2011·1 cites·11 claims
- 4960US7041552B2Integrated metal-insulator-metal capacitor and metal gate transistorIBM·Filed 2004·Granted May 9, 2006·7 cites·12 claims
- 5060US2007087541A1Method and apparatus for deposition & formation of metal silicidesGIEWONT KENNETH J·Filed 2006·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
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