Inventor · disambiguated record
Kun-A Kang
Also filed as: KANG KUN-A
11 granted patents·1,136 citations·filing 2000–2004
94Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG11
Top patents by PatentIndex Score
11 records- 0197US6355502B1Semiconductor package and method for making the sameADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Mar 12, 2002·270 cites·20 claims
- 0297US6342730B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jan 29, 2002·148 cites·8 claims
- 0396US6528893B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 4, 2003·117 cites·10 claims
- 0496US6261864B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jul 17, 2001·124 cites·14 claims
- 0595US6495909B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Dec 17, 2002·102 cites·4 claims
- 0694US6489218B1Singulation method used in leadless packaging processADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Dec 3, 2002·150 cites·15 claims
- 0794US6333252B1Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Dec 25, 2001·93 cites·8 claims
- 0889US6861295B2Low-pin-count chip package and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2001·Granted Mar 1, 2005·51 cites·15 claims
- 0986US6773961B1Singulation method used in leadless packaging processADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Aug 10, 2004·42 cites·18 claims
- 1080US6242284B1Method for packaging a semiconductor chipADVANCED SEMICONDUCTOR ENG·Filed 2000·Granted Jun 5, 2001·31 cites·18 claims
- 1160US7205658B2Singulation method used in leadless packaging processADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 17, 2007·8 cites·11 claims
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