Inventor · disambiguated record
Ryuichi Kyomasu
Also filed as: KYOMASU RYUICHI
23 granted patents·412 citations·filing 1979–2003
96Inventor score
Top patents by PatentIndex Score
23 records- 0181US6464126B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2001·Granted Oct 15, 2002·32 cites·10 claims
- 0278US6467673B2Bonding apparatus and bonding methodSHINKAWA KK·Filed 2000·Granted Oct 22, 2002·27 cites·9 claims
- 0376US6491202B1Wire bonding apparatus and methodSHINKAWA KK·Filed 2000·Granted Dec 10, 2002·23 cites·2 claims
- 0475US6449516B1Bonding method and apparatusSHINKAWA KK·Filed 1999·Granted Sep 10, 2002·49 cites·6 claims
- 0572US5486733ABonding apparatusSHINKAWA KK·Filed 1994·Granted Jan 23, 1996·44 cites·3 claims
- 0667US6762848B2Offset measurement method, tool position detection method and bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 13, 2004·13 cites·4 claims
- 0767US6189761B1Wire bonding apparatusSHINKAWA KK·Filed 2000·Granted Feb 20, 2001·14 cites·2 claims
- 0864US6467679B2Wire bonding methodSHINKAWA KK·Filed 2001·Granted Oct 22, 2002·11 cites·1 claims
- 0963US4763827AManufacturing methodHITACHI LTD·Filed 1987·Granted Aug 16, 1988·28 cites·21 claims
- 1060US5310702AMethod of preventing short-circuiting of bonding wiresKULICKE & SOFFA IND INC·Filed 1992·Granted May 10, 1994·30 cites·15 claims
- 1159US4674670AManufacturing apparatusHITACHI LTD·Filed 1985·Granted Jun 23, 1987·25 cites·12 claims
- 1258US6863206B2Bonding apparatusSHINKAWA KK·Filed 2003·Granted Mar 8, 2005·8 cites·1 claims
- 1357US5385288ABonding apparatusSHINKAWA KK·Filed 1993·Granted Jan 31, 1995·26 cites·6 claims
- 1454US6719183B2Transducer and a bonding apparatus using the sameSHINKAWA KK·Filed 2002·Granted Apr 13, 2004·7 cites·13 claims
- 1554US6422448B2Ultrasonic horn for a bonding apparatusSHINKAWA KK·Filed 2001·Granted Jul 23, 2002·6 cites·4 claims
- 1653US4347964AWire bonding apparatusHITACHI LTD·Filed 1980·Granted Sep 7, 1982·18 cites·7 claims
- 1752US4315199AControl circuit for a positioning device using a d-c motorHITACHI LTD·Filed 1979·Granted Feb 9, 1982·12 cites·2 claims
- 1851US6814121B2Bonding apparatusSHINKAWA KK·Filed 2002·Granted Nov 9, 2004·4 cites·10 claims
- 1951US6766936B2Transducer and a bonding apparatus using the sameSHINKAWA KK·Filed 2002·Granted Jul 27, 2004·5 cites·4 claims
- 2051US6727666B2XY table for a semiconductor manufacturing apparatusSHINKAWA KK·Filed 2002·Granted Apr 27, 2004·5 cites·3 claims
- 2149US6871772B2Wire bonding apparatusSHINKAWA KK·Filed 2003·Granted Mar 29, 2005·3 cites·10 claims
- 2244US6135338ACapillary holding structure for ultrasonic hornSHINKAWA KK·Filed 1998·Granted Oct 24, 2000·12 cites·6 claims
- 2341US5411195ABonding apparatusSHINKAWA KK·Filed 1994·Granted May 2, 1995·10 cites·8 claims
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