Inventor · disambiguated record
Carlton Hanna
Also filed as: HANNA CARLTON · HANNA CARLTON E
14 granted patents·16 pending applications·136 citations·filing 2003–2025
90Inventor score
Top patents by PatentIndex Score
30 records- 0196US8890628B2Ultra slim RF package for ultrabooks and smart phonesNAIR VIJAY K·Filed 2012·Granted Nov 18, 2014·72 cites·29 claims
- 0295US10049961B1Partially molded direct chip attach package structures for connectivity module solutionsINTEL IP CORP·Filed 2017·Granted Aug 14, 2018·13 cites·24 claims
- 0380US6989586B2Integrated circuit packages with reduced stress on die and associated substrates, assemblies, and systemsINTEL CORP·Filed 2003·Granted Jan 24, 2006·27 cites·38 claims
- 0478US10332821B2Partially molded direct chip attach package structures for connectivity module solutionsINTEL IP CORP·Filed 2018·Granted Jun 25, 2019·2 cites·8 claims
- 0578US10103088B1Integrated antenna for direct chip attach connectivity module package structuresINTEL IP CORP·Filed 2017·Granted Oct 16, 2018·3 cites·23 claims
- 0678US7517787B2C4 joint reliabilityINTEL CORP·Filed 2005·Granted Apr 14, 2009·8 cites·7 claims
- 0776US2025132259A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2024·Application pending·0 cites
- 0866US12211796B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 0965US12243828B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Mar 4, 2025·0 cites·20 claims
- 1065US2025157941A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2025·Application pending·0 cites
- 1160US7173842B2Metal heater for in situ heating and crystallization of ferroelectric polymer memory filmINTEL CORP·Filed 2004·Granted Feb 6, 2007·10 cites·32 claims
- 1258US2025201761A1Self-aligning semiconductor constructionINTEL CORP·Filed 2023·Application pending·0 cites
- 1357US12476176B2Glass core substrate printed circuit board for warpage reductionINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·25 claims
- 1457US7465651B2Integrated circuit packages with reduced stress on die and associated methodsINTEL CORP·Filed 2005·Granted Dec 16, 2008·1 cites·11 claims
- 1555US2025201605A1Assembly and method for preventing warpage in a semiconductor packageINTEL CORP·Filed 2023·Application pending·0 cites
- 1655US2025201622A1Support structures for semiconductor substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1754US2025210456A1Active Cooling for Heterogenous PackagesINTEL CORP·Filed 2023·Application pending·0 cites
- 1853US2023411348A1Chip-first layered packaging architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1952US12374625B2Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Granted Jul 29, 2025·0 cites·7 claims
- 2051US7656035B2C4 joint reliabilityINTEL CORP·Filed 2009·Granted Feb 2, 2010·0 cites·4 claims
- 2149US2022415814A1Microelectronic assemblies having topside power delivery structuresINTEL CORP·Filed 2021·Application pending·0 cites
- 2248US2023317705A1Thin client form factor assemblyINTEL CORP·Filed 2022·Application pending·0 cites
- 2348US2023317620A1Interposers for semiconductor devicesINTEL CORP·Filed 2022·Application pending·0 cites
- 2448US2023317618A1Glass bridge for connecting diesINTEL CORP·Filed 2022·Application pending·0 cites
- 2546US11502010B2Module installation on printed circuit boards with embedded trace technologyINTEL CORP·Filed 2016·Granted Nov 15, 2022·0 cites·14 claims
- 2646US2025244529A1Methods and apparatus for optical chip-to-chip communicationsINTEL CORP·Filed 2025·Application pending·0 cites
- 2744US2023299014A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 2844US2023299013A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 2944US2023299012A1Microelectronic assemblies including stiffenersINTEL CORP·Filed 2022·Application pending·0 cites
- 3036US2018286815A1Shielding solutions for direct chip attach connectivity module package structures having shielding structures attached to package structuresINTEL IP CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →