Inventor · disambiguated record

Syozo Yano

Also filed as: YANO SYOZO

1 granted patent·0 citations·filing 2007–2007

2Inventor score

Technology areasH10P

Files withFURUKAWA ELECTRIC CO LTD1

Top patents by PatentIndex Score

1 record

0135US7985474B2Wafer-dicing adhesive tape and method of producing chips using the sameFURUKAWA ELECTRIC CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·8 claims

Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →