Inventor · disambiguated record
Tyler W. Garaas
Also filed as: GARAAS TYLER · GARAAS TYLER W
8 granted patents·2 pending applications·47 citations·filing 2010–2021
83Inventor score
Files withGARAAS TYLER W3MITSUBISHI ELECTRIC RES LABORATORIES INC3AMAZON TECH INC2MITSUBISHI ELECTRIC RES LAB2
Top patents by PatentIndex Score
10 records- 0188US12430792B1Item pick pose recoveryAMAZON TECH INC·Filed 2021·Granted Sep 30, 2025·2 cites·16 claims
- 0288US9420265B2Tracking poses of 3D camera using points and planesMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2013·Granted Aug 16, 2016·20 cites·14 claims
- 0385US8442306B2Volume-based coverage analysis for sensor placement in 3D environmentsGARAAS TYLER W·Filed 2010·Granted May 14, 2013·13 cites·20 claims
- 0484US11970343B1Multimodal identification system and method for robotic item manipulatorsAMAZON TECH INC·Filed 2021·Granted Apr 30, 2024·3 cites·17 claims
- 0576US9678499B2Method for controlling redundantly actuated machines for cutting a pattern of disconnected contoursMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2014·Granted Jun 13, 2017·3 cites·20 claims
- 0676US9046888B2Method and system for detouring around features cut from sheet materials with a laser cutter according to a patternGARAAS TYLER W·Filed 2012·Granted Jun 2, 2015·4 cites·10 claims
- 0772US9703915B2Method for determining a sequence for drilling holes according to a pattern using global and local optimizationMITSUBISHI ELECTRIC RES LABORATORIES INC·Filed 2014·Granted Jul 11, 2017·2 cites·16 claims
- 0842US2015296324A1Method and Apparatus for Interacting Between Equipment and Mobile DevicesMITSUBISHI ELECTRIC RES LAB·Filed 2014·Application pending·0 cites
- 0942US2016011667A1System and Method for Supporting Human Machine InteractionMITSUBISHI ELECTRIC RES LAB·Filed 2014·Application pending·0 cites
- 1040US9248525B2Method and system for cutting features from sheet materials with a laser cutter according to a patternGARAAS TYLER W·Filed 2012·Granted Feb 2, 2016·0 cites·24 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →