Inventor · disambiguated record
Darrell G. Hill
Also filed as: HILL DARRELL · HILL DARRELL G · HILL DARRELL GLENN
70 granted patents·10 pending applications·673 citations·filing 1991–2025
99Inventor score
Files withNXP USA INC29TEXAS INSTRUMENTS INC20FREESCALE SEMICONDUCTOR INC9GREEN BRUCE M5MOTOROLA INC5
Top patents by PatentIndex Score
80 records- 0197US9799760B2Semiconductor device with selectively etched surface passivationFREESCALE SEMICONDUCTOR INC·Filed 2015·Granted Oct 24, 2017·17 cites·18 claims
- 0295US9362198B2Semiconductor devices with a thermally conductive layer and methods of their fabricationVISWANATHAN LAKSHMINARAYAN·Filed 2014·Granted Jun 7, 2016·22 cites·20 claims
- 0394US10879168B2Transistor with non-circular via connections in two orientationsNXP USA INC·Filed 2020·Granted Dec 29, 2020·3 cites·5 claims
- 0491US8410580B2Device having conductive substrate via with catch-pad etch-stopHILL DARRELL G·Filed 2011·Granted Apr 2, 2013·13 cites·20 claims
- 0587US12211759B2Circuit die with isolation test structureNXP USA INC·Filed 2022·Granted Jan 28, 2025·1 cites·18 claims
- 0687US9685345B2Semiconductor devices with integrated Schottky diodes and methods of fabricationGREEN BRUCE M·Filed 2013·Granted Jun 20, 2017·6 cites·19 claims
- 0786US10629526B1Transistor with non-circular via connections in two orientationsNXP USA INC·Filed 2018·Granted Apr 21, 2020·3 cites·15 claims
- 0886US8946776B2Semiconductor device with selectively etched surface passivationGREEN BRUCE M·Filed 2012·Granted Feb 3, 2015·6 cites·18 claims
- 0986US6028348ALow thermal impedance integrated circuitTEXAS INSTRUMENTS INC·Filed 1993·Granted Feb 22, 2000·54 cites·16 claims
- 1085US10741496B2Semiconductor devices with a protection layer and methods of fabricationNXP USA INC·Filed 2018·Granted Aug 11, 2020·4 cites·21 claims
- 1183US11088661B2Power amplifier devices containing inverted power transistor dies and methods for the fabrication thereofNXP USA INC·Filed 2019·Granted Aug 10, 2021·3 cites·20 claims
- 1283US10594276B2Multi-path amplifier circuit or system and methods of implementation thereofNXP USA INC·Filed 2018·Granted Mar 17, 2020·4 cites·20 claims
- 1382US10128364B2Semiconductor devices with an enhanced resistivity region and methods of fabrication thereforFREESCALE SEMICONDUCTOR INC·Filed 2016·Granted Nov 13, 2018·3 cites·24 claims
- 1481US12334416B2Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structureNXP USA INC·Filed 2023·Granted Jun 17, 2025·0 cites·7 claims
- 1581US2025285942A1Through substrate via (tsv) validation structure for an integrated circuit and method to form the tsv validation structureNXP USA INC·Filed 2025·Application pending·0 cites
- 1680US10541324B2Semiconductor device with a recessed ohmic contact and methods of fabricationNXP USA INC·Filed 2017·Granted Jan 21, 2020·2 cites·15 claims
- 1780US5710068ALow thermal impedance integrated circuitTEXAS INSTRUMENTS INC·Filed 1995·Granted Jan 20, 1998·53 cites·12 claims
- 1879US9779988B2Semiconductor devices with inner viaHILL DARRELL G·Filed 2013·Granted Oct 3, 2017·7 cites·20 claims
- 1979US5445976AMethod for producing bipolar transistor having reduced base-collector capacitanceTEXAS INSTRUMENTS INC·Filed 1994·Granted Aug 29, 1995·43 cites·14 claims
- 2078US11444044B2Transistor die with output bondpad at the input side of the die, and power amplifiers including such diesNXP USA INC·Filed 2019·Granted Sep 13, 2022·2 cites·27 claims
- 2178US9153448B2Semiconductor device with selectively etched surface passivationGREEN BRUCE M·Filed 2015·Granted Oct 6, 2015·2 cites·20 claims
- 2277US10522670B2Semiconductor device with selectively etched surface passivationNXP USA INC·Filed 2017·Granted Dec 31, 2019·2 cites·23 claims
- 2376US7849540B2Reusable surgical perioperative positioning systemHEALTH CARE POSITIONERS INC·Filed 2007·Granted Dec 14, 2010·19 cites·18 claims
- 2475US6465297B1Method of manufacturing a semiconductor component having a capacitorMOTOROLA INC·Filed 2000·Granted Oct 15, 2002·18 cites·21 claims
- 2574US6368929B1Method of manufacturing a semiconductor component and semiconductor component thereofMOTOROLA INC·Filed 2000·Granted Apr 9, 2002·16 cites·12 claims
- 2674US5298438AMethod of reducing extrinsic base-collector capacitance in bipolar transistorsTEXAS INSTRUMENTS INC·Filed 1992·Granted Mar 29, 1994·27 cites·6 claims
- 2773US9111868B2Semiconductor device with selectively etched surface passivationGREEN BRUCE M·Filed 2012·Granted Aug 18, 2015·2 cites·17 claims
- 2873US7723224B2Microelectronic assembly with back side metallization and method for forming the sameFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 25, 2010·7 cites·12 claims
- 2973US5389554AMethod for fabricating microwave heterojunction bipolar transistors with emitters designed for high power applicationsTEXAS INSTRUMENTS INC·Filed 1993·Granted Feb 14, 1995·28 cites·8 claims
- 3072US11450616B2Using a backside mask layer for forming a unique die mark identifier patternNXP USA INC·Filed 2020·Granted Sep 20, 2022·1 cites·17 claims
- 3172US7335955B2ESD protection for passive integrated devicesFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Feb 26, 2008·5 cites·13 claims
- 3271US11823978B2Through substrate via (TSV) validation structure for an integrated circuit and method to form the TSV validation structureNXP USA INC·Filed 2021·Granted Nov 21, 2023·0 cites·7 claims
- 3370US10957790B2Semiconductor device with selectively etched surface passivationNXP USA INC·Filed 2018·Granted Mar 23, 2021·1 cites·19 claims
- 3470US10825924B2Semiconductor device with selectively etched surface passivationNXP USA INC·Filed 2017·Granted Nov 3, 2020·1 cites·20 claims
- 3570US5552617ABipolar transistorTEXAS INSTRUMENTS INC·Filed 1995·Granted Sep 3, 1996·26 cites·16 claims
- 3669US10438940B2ESD protection for depletion-mode devicesNXP USA INC·Filed 2016·Granted Oct 8, 2019·1 cites·19 claims
- 3769US8609538B2Methods relating to the fabrication of devices having conductive substrate vias with catch-pad etch-stopsHILL DARRELL G·Filed 2013·Granted Dec 17, 2013·2 cites·20 claims
- 3868US5789301AMethod for reducing extrinsic base-collector capacitanceTRIQUINT SEMICONDUCTOR INC·Filed 1996·Granted Aug 4, 1998·21 cites·16 claims
- 3967US6798064B1Electronic component and method of manufactureMOTOROLA INC·Filed 2000·Granted Sep 28, 2004·15 cites·16 claims
- 4064US5702958AMethod for the fabrication of bipolar transistorsTEXAS INSTRUMENTS INC·Filed 1994·Granted Dec 30, 1997·23 cites·12 claims
- 4163US8160518B2Multi-mode transceiver having tunable harmonic termination circuit and method thereforRAY MARCUS R·Filed 2007·Granted Apr 17, 2012·4 cites·14 claims
- 4261US7642182B2ESD protection for passive integrated devicesFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Jan 5, 2010·2 cites·9 claims
- 4361US2025183108A1Circuit die with chamfered passivation layerNXP USA INC·Filed 2023·Application pending·0 cites
- 4460US2024429185A1Structures for suppressing odd-mode instabilitiesNXP USA INC·Filed 2024·Application pending·0 cites
- 4559US2025211172A1Transistor circuits with independently biased field platesNXP USA INC·Filed 2023·Application pending·0 cites
- 4658US12266713B2Transistor with dielectric spacers and method of fabrication thereforNXP USA INC·Filed 2022·Granted Apr 1, 2025·0 cites·7 claims
- 4757US12464798B2Transistor with aligned field plate and method of fabrication thereforNXP USA INC·Filed 2021·Granted Nov 4, 2025·0 cites·25 claims
- 4857US12369380B2Transistor with dielectric spacers and field plate and method of fabrication thereforNXP USA INC·Filed 2022·Granted Jul 22, 2025·0 cites·18 claims
- 4957US11842996B2Transistor with odd-mode oscillation stabilization circuitNXP USA INC·Filed 2021·Granted Dec 12, 2023·0 cites·18 claims
- 5057US6621351B2RF amplifier and method thereforMOTOROLA INC·Filed 2001·Granted Sep 16, 2003·8 cites·20 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →