Inventor · disambiguated record
Reinhold Spanke
Also filed as: SPANKE REINHOLD
11 granted patents·213 citations·filing 1989–2017
90Inventor score
Files withINFINEON TECHNOLOGIES AG4EUPEC GMBH & CO KG2BAYERER REINHOLD1BORGHOFF GEORG1EUPEC EUROP GESELLSCH F LEISTU1
Top patents by PatentIndex Score
11 records- 0183US7656672B2Power moduleINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 2, 2010·13 cites·7 claims
- 0281US10283447B1Power semiconductor module with partially coated power terminals and method of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2017·Granted May 7, 2019·5 cites·22 claims
- 0378US4932891ADual flat-spring electrical contactWEIDMUELLER C A GMBH CO·Filed 1989·Granted Jun 12, 1990·40 cites·11 claims
- 0476US5459356APower semiconductor module having a plurality of semiconductor arrangementsEUPEC EUROP GESELLSCH F LEISTU·Filed 1995·Granted Oct 17, 1995·74 cites·7 claims
- 0573US7763970B2Power moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 27, 2010·6 cites·23 claims
- 0671US5508560ASemiconductor moduleEUPEC GMBH & CO KG·Filed 1994·Granted Apr 16, 1996·53 cites·5 claims
- 0759US7968988B2Power semiconductor module having a thermally conductive base plate on which at least four substrates are arranged in at least one single rowINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jun 28, 2011·2 cites·17 claims
- 0853US8222741B2Semiconductor module with current connection elementBAYERER REINHOLD·Filed 2007·Granted Jul 17, 2012·1 cites·15 claims
- 0950US5617293ABridge moduleEUPEC GMBH & CO KG·Filed 1995·Granted Apr 1, 1997·19 cites·5 claims
- 1035US8148198B2Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensorBORGHOFF GEORG·Filed 2006·Granted Apr 3, 2012·0 cites·4 claims
- 1123US8569881B2Semiconductor deviceSPANKE REINHOLD·Filed 2010·Granted Oct 29, 2013·0 cites·16 claims
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