Inventor · disambiguated record
Soo-Jae Park
Also filed as: PARK SOO-JAE
9 granted patents·1 pending application·16 citations·filing 2014–2022
80Inventor score
Top patents by PatentIndex Score
10 records- 0191US9978693B2Integrated circuit package, method of fabricating the same, and wearable device including integrated circuit packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 22, 2018·9 cites·20 claims
- 0281US10204869B2Integrated circuit package including shielding between adjacent chipsSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 12, 2019·3 cites·22 claims
- 0380US10586748B2Printed circuit board and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 10, 2020·3 cites·5 claims
- 0462US10448508B2Printed circuit board and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 15, 2019·1 cites·13 claims
- 0556US10950517B2Printed circuit board and semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Mar 16, 2021·0 cites·5 claims
- 0647US12482783B2Semiconductor package including bonding wire coated with oxide insulation, electronic system including same, and battery module including samePARK SOO JAE·Filed 2022·Granted Nov 25, 2025·0 cites·12 claims
- 0740US9368465B2Method of forming bump pad structure having buffer patternSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 14, 2016·0 cites·20 claims
- 0839US10770384B2Printed circuit board having insulating metal oxide layer covering connection padSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Sep 8, 2020·0 cites·18 claims
- 0935US9396979B2Wafer carrier including air filtersSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 19, 2016·0 cites·19 claims
- 1024US2016233112A1Release film for controlling flow of resin and method of manufacturing semiconductor package using the samePARK SOO-JAE·Filed 2016·Application pending·0 cites
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