Inventor · disambiguated record
Ching-Hua Tsao
Also filed as: TSAO CHING-HUA
4 granted patents·12 citations·filing 2001–2006
67Inventor score
Top patents by PatentIndex Score
4 records- 0176US7417313B2Method for manufacturing an adhesive substrate with a die-cavity sidewallADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 26, 2008·5 cites·11 claims
- 0273US7344915B2Method for manufacturing a semiconductor package with a laminated chip cavityADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 18, 2008·7 cites·22 claims
- 0341US7172926B2Method for manufacturing an adhesive substrate with a die-cavity sidewallADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Feb 6, 2007·0 cites·27 claims
- 0415US6638438B2Printed circuit board micro hole processing methodULISATERA CORP·Filed 2001·Granted Oct 28, 2003·0 cites·10 claims
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