Inventor · disambiguated record
Yoshio Yokota
Also filed as: YOKOTA YOSHIO
7 granted patents·137 citations·filing 1989–2001
87Inventor score
Top patents by PatentIndex Score
7 records- 0167USD459705SSemiconductor packageSHINDENGEN ELECTRIC MFG·Filed 2001·Granted Jul 2, 2002·19 cites·1 claims
- 0261US4996586ACrimp-type semiconductor device having non-alloy structureTOSHIBA KK·Filed 1989·Granted Feb 26, 1991·27 cites·15 claims
- 0355US5028974ASemiconductor switching device with anode shortening structureTOSHIBA KK·Filed 1990·Granted Jul 2, 1991·19 cites·21 claims
- 0453US5376815ASemiconductor device having bipolar-mos composite element pellet suitable for pressure contacted structureTOSHIBA KK·Filed 1993·Granted Dec 27, 1994·17 cites·6 claims
- 0551US5223442AMethod of making a semiconductor device of a high withstand voltageTOSHIBA KK·Filed 1992·Granted Jun 29, 1993·21 cites·2 claims
- 0650US5156981AMethod of making a semiconductor device of a high withstand voltageTOSHIBA KK·Filed 1989·Granted Oct 20, 1992·17 cites·2 claims
- 0746US5210601ACompression contacted semiconductor device and method for making of the sameTOSHIBA KK·Filed 1992·Granted May 11, 1993·17 cites·12 claims
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