Inventor · disambiguated record
Daragh Finn
Also filed as: FINN DARAGH · FINN DARAGH S · FINN DARAGH SEOSAMH
8 granted patents·3 pending applications·39 citations·filing 2010–2020
83Inventor score
Top patents by PatentIndex Score
11 records- 0189US8383984B2Method and apparatus for laser singulation of brittle materialsELECTRO SCIENT IND INC·Filed 2010·Granted Feb 26, 2013·11 cites·50 claims
- 0286US8598490B2Methods and systems for laser processing a workpiece using a plurality of tailored laser pulse shapesHOOPER ANDREW·Filed 2011·Granted Dec 3, 2013·14 cites·27 claims
- 0381US10328529B2Laser scan sequencing and direction with respect to gas flowELECTRO SCIENT IND INC·Filed 2016·Granted Jun 25, 2019·2 cites·20 claims
- 0479US8894868B2Substrate containing aperture and methods of forming the sameHOOPER ANDY·Filed 2011·Granted Nov 25, 2014·7 cites·33 claims
- 0575US8800475B2Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layerELECTRO SCIENT IND INC·Filed 2014·Granted Aug 12, 2014·3 cites·9 claims
- 0662US8673741B2Etching a laser-cut semiconductor before dicing a die attach film (DAF) or other material layerFINN DARAGH S·Filed 2011·Granted Mar 18, 2014·2 cites·12 claims
- 0757US2021331273A1Laser processing apparatus and methods of laser-processing workpiecesELECTRO SCIENT IND INC·Filed 2017·Application pending·0 cites
- 0851US8679948B2Method and apparatus for laser singulation of brittle materialsELECTRO SCIENT IND INC·Filed 2013·Granted Mar 25, 2014·0 cites·13 claims
- 0950US2022168847A1Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the sameELECTRO SCIENT IND INC·Filed 2020·Application pending·0 cites
- 1032US2011287607A1Method and apparatus for improved wafer singulationOSAKO YASU·Filed 2011·Application pending·0 cites
- 1127US8666530B2Silicon etching control method and systemFINN DARAGH SEOSAMH·Filed 2010·Granted Mar 4, 2014·0 cites·19 claims
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