Inventor · disambiguated record
Jinduck Park
Also filed as: PARK JINDUCK
3 granted patents·1 pending application·2 citations·filing 2020–2023
49Inventor score
Files withSAMSUNG ELECTRONICS CO LTD4
Top patents by PatentIndex Score
4 records- 0174US11676923B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 13, 2023·2 cites·9 claims
- 0248US12431442B2Semiconductor chips having recessed regionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 0348US2024047328A1Semiconductor package with substrate cavitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0441US11474149B2Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
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