Inventor · disambiguated record
Harold Ryan Chase
Also filed as: CHASE HAROLD R · CHASE HAROLD RYAN
7 granted patents·14 citations·filing 2012–2018
78Inventor score
Top patents by PatentIndex Score
7 records- 0180US9198293B2Non-cylindrical conducting shapes in multilayer laminated substrate coresCHASE HAROLD R·Filed 2013·Granted Nov 24, 2015·8 cites·20 claims
- 0276US10312007B2Inductor formed in substrateINTEL CORP·Filed 2012·Granted Jun 4, 2019·3 cites·11 claims
- 0370US9406587B2Substrate conductor structure and methodCHASE HAROLD RYAN·Filed 2012·Granted Aug 2, 2016·2 cites·14 claims
- 0461US9275975B2Electronic package and method of connecting a first die to a second die to form an electronic packageCHASE HAROLD RYAN·Filed 2014·Granted Mar 1, 2016·1 cites·9 claims
- 0560US10734282B2Substrate conductor structure and methodINTEL CORP·Filed 2018·Granted Aug 4, 2020·0 cites·11 claims
- 0655US10121701B2Substrate conductor structure and methodINTEL CORP·Filed 2016·Granted Nov 6, 2018·0 cites·10 claims
- 0751US9741686B2Electronic package and method of connecting a first die to a second die to form an electronic packageINTEL CORP·Filed 2016·Granted Aug 22, 2017·0 cites·5 claims
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